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SH888, S868, Standare Electrical Repair
If the fault remains, replace D600 (class B, fig. 4.4). If that doesn't help, send the
phone to the next level.
4.7 Microphone and earphone fault.
Check the contact pads at the system connector for dirt, liquid damages and oxida-
tion. Replace the system connector if needed.
Open the phone and check for liquid damages, especially around the system connec-
tor pads.
Check the solderings at D600 pins 67 and 70 (fig. 4.4).
Measure the resistance from EXTAUD (fig. 4.5) to ground (>20 kohms).
• If it's less, replace F600 (class A, fig. 4.1).
Fig. 4.5
Measure the resistance from PORTHF (fig. 4.5) to ground (>10 kohms).
• If it's less, replace F602 (class A, fig. 4.1).
Measure the resistance of R635 (~22 kohms, fig. 4.1), R636 (~22 kohms, fig. 4.4),
R601 (~1 kohms, fig. 4.4) and R605 (~1 kohms, fig. 4.1, all of class A).
If the fault remains, replace D600 (class B, fig. 4.4). If that doesn't help, send the
phone to the next level.
4.8 Signal processing error.
Open the phone and check for liquid damages.
Give the board power and start it up.
Check the VDIG and VDSP voltages (~3.2V, fig. 4.6).
• If any of the voltages are incorrect, proceed to chapter 3 ("Doesn´t start"-fault).
Check the VDSPC voltage (~2.5V, fig. 4.6).
• If it's less, measure the resistance from it to ground (>10 kohms).
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