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(AXA1)
SPECIFICATIONS
1. Characteristics (Complies with miniSD™ card and application note specification Ver. 1.0.)
Item
Rated current
Contact resistance
Electrical
characteristics
Insulation resistance
Breakdown voltage
Vibration resistance
Mechanical
characteristics
Insertion and removal force of
miniSD™ card
Insertion and removal force of
adapter
Lifetime
Insertion and removal life of
characteristics
miniSD™ card and adapter
Ambient temperature
Storage temperature
Environment
characteristics
Humidity tolerance (mated
condition)
Unit weight
2. Material and surface treatment
Portion
Signal contact
3. Applicable memory card and socket
Cards complying with miniSD™ card specification Ver. 1.02.
DIMENSIONS
(Unit: mm)
CAD Data
Movable angle
Note: An indication, such as a logo, specified by the customer can be marked on the
SD logo-printed surface through a separate agreement on the specifications.
Matsushita Electric Works, Ltd.
0.5A/1 terminal
Max. 100mΩ
Min. 1,000MΩ (Initial)
500V AC for 1 min. (Initial)
No current interruption for more than 0.1 µs
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf},
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf}, Max. 40N {4.08kgf}
Insertion and removal life: 10,000 times
Contact resistance after testing: Max. 100mΩ
–25°C to +85°C
–40°C to +85°C
(The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Contact resistance: Max. 100mΩ
Insulation resistance: Min. 100MΩ
1.40g
Material
Copper alloy
Memory card
The CAD data of the products with a
12.0
16.0
14.5
8.0
12.0
20.1
24.0±0.1
mini SD memory card
0
22.5
–0.1
Specifications
Max. 40N {4.08kgf}
Contact portion: Ni plating on base, PdNi + Au plating on surface
Sockets complying with SD memory card specification Ver. 2.0.
CAD Data
Area where logo, etc.,
can be printed
(0.02 mm recess)
4.0
Condition
Measured based on the HP4338B measurement
method of JIS C 5402
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
Frequency: 10 to 2,000 Hz
Acceleration: 20.0 m/s
{2.0G}
2
Measured while mated with SD memory card socket
mounted on evaluation board.
Force required for insertion and removal of miniSD™
card to and from miniSD™ adapter.
Force required for insertion and removal into and out of
SD memory card socket with a miniSD™ card mated.
Insertion and removal speed are at a rate of 400 times/
hour or less.
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C,
Humidity: 90 to 95%RH,
Test time: 500 hours
Surface
Socket
mark can be downloaded from: http://www.mew.co.jp/ac/e
6 × P2.5 = 15.0
2.425
1.70
Write abled
Write enabled
Max.13.0
10.0
Part No./Country of origin/Lot
http://www.mew.co.jp/ac/e/
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