Chapter 2. Installing And Removing Components; Installation Guidelines - IBM BladeCenter Installation Manual

Chapter 2. Installing and removing components

See the Installation and User's Guide for your BladeCenter unit type for
information about the I/O-module bay locations in the BladeCenter unit and
specific requirements for installing I/O modules in your BladeCenter unit.
Attention: To maintain proper system cooling, each I/O-module bay must
contain either an I/O module or a filler module.
For details about network interface requirements and expansion options, see
the following documents:
v Installation and User's Guide for your BladeCenter unit type
v Installation and User's Guide for each blade server type

Installation guidelines

Before you begin to install the I/O module in your BladeCenter unit, read the
following information:
v Read the safety information that begins on page v and the guidelines in
"Handling static-sensitive devices" on page 10, and read the safety
statements in the BladeCenter unit publications. This information will help
you work safely.
v Observe good housekeeping in the area where you are working. Place
removed covers and other parts in a safe place.
v Do not attempt to lift an object that you think is too heavy for you. If you
have to lift a heavy object, observe the following precautions:
– Make sure that you can stand safely without slipping.
– Distribute the weight of the object equally between your feet.
– Use a slow lifting force. Never move suddenly or twist when you lift a
heavy object.
– To avoid straining the muscles in your back, lift by standing or by
pushing up with your leg muscles.
v Make sure that you have an adequate number of properly grounded
electrical outlets for the BladeCenter unit, monitor, and other devices.
v Back up all important data before you make changes to disk drives.
v Have a small flat-blade screwdriver available.
v You do not have to turn off the BladeCenter unit to install or replace any of
the hot-swap modules in the BladeCenter unit.
v Orange on the release latch on the I/O module identifies this device as a
hot-swap component. You can install or remove this component while the
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