E22 Series - Ebyte E22-400T30D User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
12.2 Reflow soldering curve

13 E22 series

Model No. Core IC
E22-900T22S SX1262
E22-230T22S SX1262
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Aveage ramp-down rate
Time to peak temperature for
25℃
Frequency Tx power
Hz dBm
868M 915M 22
230M 22
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
max 6 minutes
Distance
Package
km
7 SMD
7 SMD
E22-400T30D User Manual
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
max 8 minutes
Size
Interface
mm
16*26 UART
16*26 UART
22