Safran Sagem Communication myC2-3 Site Technical Documentation page 74

myC2-3
7RROV
-Tweezers
3UpOLPLQDU\ RSHUDWLRQ
1. Remove the battery (Proc sheet 0 01).
2. Remove the lower housing of mobile (Proc sheet 1 01).
3. Remove the keyboard (Proc sheet 1 04))
4. Remove MMI board (Proc sheet 1 07).
5. Remove the flap (Proc sheet 1 09).
5HPRYDO SURFHGXUH
1. Take FPC conductive foam with tweezers (1)
3ODFHPHQW SURFHGXUH
1. Position the FPC conductive foam on it place (2).
2. Check the FPC conductive is well stuck on the lower housing (3)
)XUWKHU RSHUDWLRQV
1. Place Flap (Proc sheet 1 10)
2. Place the flap (Proc sheet 1 09)
3. Place the keyboard ( Proc sheet 1 04).
4. Place the board MMI (Proc sheet 1 07).
5. Place the lower housing of mobile (Proc sheet 1 01).
6.
Place of the battery (Proc sheet 0 01)

Contents
5HPRYH DQG SODFH )3&
FRQGXFWLYH IRDP RI XSSHU
KRXVLQJ IODS

REF MTB DTS 8- Indice B - February 21 2006
Proc sheet 1 11
1/1

Procedure
Proc 0 01
Proc 1 01
Proc 1 02
Proc 1 03
Proc 1 04
Proc 1 05
Proc 1 06
Proc 1 07
Proc 1 08
Proc 1 09
Proc 1 10
Proc 1 11
Proc 1 12
Proc 2 02
Proc 3 01
Proc 3 02
Proc 4 01
Symptom
Symp 01
Symp 02
Symp 03
Symp 04
Symp 05
Symp 06
Symp 07
Symp 08
Symp 10
Test
Test 01
Test 02
Test 03
Test 04
Test 05
Test 06
Page 5-18