Safran Sagem Communication myC2-3 Site Technical Documentation page 73

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-Tweezers
- Cross shaped screw
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1. Remove the battery (Proc sheet 0 01).
2. Remove the lower housing of mobile (Proc sheet 1 01).
3. Remove the keyboard (Proc sheet 1 04))
4. Remove MMI board (Proc sheet 1 07).
5. Remove the flap (Proc sheet 1 09).
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1. Remove the 4 mask screw (1,2).
2. Fall and remove the 4 screw (3).
3. Open the flap beginning by the hinge (4).
4. lower housing flap (5) et upper housing (6)
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1. Lock the lower housing and upper flap housing together(5,6).
2. Position and screw (torque of 0.07 N.m) the 4 flap screw fixing (3).
3. Position the 4 mask screw (1,2).
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1. Place the flap (Proc sheet 1 09)
2. Place the keyboard ( Proc sheet 1 04).
3. Place the board MMI (Proc sheet 1 07).
4. Place the lower housing of mobile (Proc sheet 1 01).
5. Place of the battery (Proc sheet 0 01)
Contents
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REF MTB DTS 8- Indice B - February 21 2006
Proc sheet 1 10
Risk of the procedude:
Damage the FPC
Damage plastic component


Procedure
Proc 0 01
Proc 1 01
Proc 1 02
Proc 1 03
1/1
Proc 1 04
Proc 1 05
Proc 1 06
Proc 1 07
Proc 1 08
Proc 1 09
Proc 1 10
Proc 1 11
Proc 1 12
Proc 2 02
Proc 3 01
Proc 3 02
Proc 4 01
Symptom
Symp 01
Symp 02
Symp 03
Symp 04
Symp 05
Symp 06
Symp 07
Symp 08
Symp 10
Test
Test 01
Test 02
Test 03
Test 04
Test 05
Test 06


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