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DAB board
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade)
forward side
R90
R87
R89
Q82
R88
C93
C4
C81
C92
R3
R82
R4
C1
C7
C8
R5
TU91
C9
C11
R91
R6
R141
C73
C72
IC71
C74
reverse side
NC7
KEY3
NC10
NC8
KEY1
KEY2
NC95
KEY0
NC94
NC87
JBUSCK
SDCK
NC79
SDWD
SDDA
INDO0
INDO2
CN141
R92
C95
R99
R98
C24
C22
C23
R1
R2
C12
C14
C13
DAC9
XO
JBUSINT
CN101
NC35
NC38
DISG0
AMUTEL
TS_DAT
NC40
TS_CLK
LCDRS
AMUTER
LCKR/W
LCDDB2
LCDDB4
C104
C103
C105
X1
C26
R113
R114
R115
R116
R117
R118
R119
R120
R14
R13
NC49
R12
R143
C15
C54
C53
DAC12
DISG1
DISG3 PWMVCXO
TS_SYNC
DISG2
DAOUT
CN121
SDAT2
DDOWMSC
X101
R106
R104
R105
C101
R103
C102
R101
R102
R138
R137
R136
R134
R128
R127
R125
IC101
R133
R132
R131
C107
R142
R126
D141
CN141
TU91
ADCOVR
NULMON
AGCDAT
SDODT
SDOCK
SDOWD
RDIOUT
FSYO
DDOERF
2-7
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