HP 15 Product End-Of-Life Disassembly Instructions page 2

Item Description
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove base rubber foot *2, base screw *8 and base sub-assy.
2. Remove front / rear side rubber , base screw*8 and base sub assy.
3. Remove battery screw*5 and take out battery
4. Remove SSD screw*1 and take out SSD
5. Remove fan screw*3 and take out fan
6. Remove Wlan card screw*1 and take out WLAN card
7. Remove RAM card*2
8. Remove ,TP module screw*5 ,
9. Remove USB board screw*2 and take out USB board
10. Remove Audio board screw*2 and take out Audio board
11. Remove M/B screw*7 and take out M/B
12. Remove L/R speaker screw*2 and DC cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations)
3.21 Total part
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPI instructions for this template are available at EL-MF877-01
Quantity of
items
included in
product
Tool Size (if
applicable)
#1
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