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Item Description
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Screwdriver
Slothead screwdriver
Allen screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Remove the rubber and screw on the column and hinge, then pull out the stand form the monitor head.
2. Separate the RC form the monitor head through the tear down slots which on the bottom side.
3.
Unlock the back light wire*2 and LVDS*2 from the panel.
4.
Remove the adhesive tape on the bucket and remove the back light wires from the LED driver board.
5.
Remove screws *12 on the chassis and bucket.
6.
Disconnect the FFC from the connector. And separate the CTRL BD from the holder by hand.
7.
Unlock 5 screws on the chassis and PCBA. And separate PCBAs from the chassis.
8.
Disconnect the wire from the interface board.
9. Disconnect the LVDS from the interface board.
10. Release the screws on the hinge and bucket.
11. Remove the hinge POM
12. Tear the rubber foot from base
13. Separate the base plate and base cover.
EL-MF877-00
Template Revision C
Last revalidation date 09-May-2018
Notes
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPI instructions for this template are available at
EL-MF877-01
Quantity of
items
included in
product
0
0
0
0
Tool Size (if
applicable)
2
1
1
Page 2
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