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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Model Name
Description
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or
Printed Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing
toner and ink, including liquids, semi-
liquids (gel/paste) and toner
Components and waste containing
asbestos
Components, parts and materials
HP Z5000 Series Digital Entertainment Center
Desktop PC
Notes
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner
lamps, switches, batteries
Includes background illuminated
displays with gas discharge lamps
Declaration limited to case
plastics only.
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
13-Oct-2004
Quantity of items included in
product.
12
1
0
0
0
0
0
0
0
0
0
0
0
Page 1
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Table of Contents
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Summary of Contents for HP Z5000 Series
- Page 1 Description Desktop PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
- Page 2 HP-00007-01, Appendix 3 13-Oct-2004 containing refractory ceramic fibers Components, parts and materials containing radioactive substances Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 ODD door sub-assembly Disassemble: pushing ODD door sub-assembly rightward, taking ODD door sub-assembly out of Main Bezel HP Jewel logo Disassemble: using thin slice iron to push HP Jewel logo out ODD door plate, spring and spring pin Disassemble: using knife to pull ODD door plate out...
- Page 4 HP-00007-01, Appendix 3 13-Oct-2004 Magnet Disassemble: using clipper to pull three Magnet out of Main Bezel HDD Bay door and spring Disassemble: taking away both side of spring, taking HDD Bay door and spring out of HDD Bay HDD Bay connector Disassemble: loosing two screws, taking HDD Bay connector out of...
- Page 5 HP-00007-01, Appendix 3 13-Oct-2004 Front AV Board Disassemble: loosing three screws, taking Front AV Board out of Front AV Board bracket FAN Disassemble: pressing three hooks, taking FAN out of FAN Holder HDD and HDD screw rubber Disassemble: loosing four screws, taking HDD and HDD...
- Page 6 HP-00007-01, Appendix 3 13-Oct-2004 HP Restricted Page 1...
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