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HP ProDesk 405 G1 Disassembly Instructions Manual
HP ProDesk 405 G1 Disassembly Instructions Manual

HP ProDesk 405 G1 Disassembly Instructions Manual

Microtower business pc
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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 405 G1 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Power cord
system fan 94g,PSU fan 68g
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
5
1
162g
Page 1

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Summary of Contents for HP ProDesk 405 G1

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 Figure3 Rotate the top of the panel away to remove it Figure4 Pull the 3 hooks and rotate to remove the front bezel Figure5 Disconnect the cooler cable from MB Figure6 Loose 4 screws from cooler and remove it EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at...
  • Page 4 Figure7 Remove the cooler from board Figure8 Disconnect the SATA cables form board Figure9 Disconnect the CPU power cable from board Figure10 Disconnect the 24pin power cable from MB EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 5 Figure11 Disconnect the SATA and power cables from Figure12 Loose the ODD screws Figure13 Remove the ODD from chassis Figure14 Disconnect the SATA and power cables from EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 6 Figure15 Loose the HDD screws Figure16 Remove the HDD form chassis Figure17 Disconnect the MCR cable from MB Figure18 Loose the MCR screws EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 7 Figure19 Remove the MCR from chassis Figure20 Disconnect system fan cable from board Figure21 Loose 2 screws from system fan Figure22 Remove the system fan from chassis EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 8 Figure23 Disconnect FIO cable include USB 3.0 , USB 2.0 , Figure24 Open the cable clip Audio Figure25 Loose the screw of the FIO cable Figure26 Remove the FIO cable from chassis EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9 Figure27 Disconnect PWR cable from MB Figure28 Remove the PWR cable Figure29 Disconnect speaker cable from board Figure30 Loose the screw of speaker EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 10 Figure31 Remove the speaker form chassis Figure32 Push the hooks on both sides and then pick up the memory Figure33 Remove the battery from the MB Figure34 Loose the 6 screws from MB EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 11 Figure35 Loose the 8 screws from MB and remove it Figure36 Remove MB from chassis Figure37 Push the I/O shielding to the inside of the chassis Figure38 Loose 4 screws of PSU and remove it and remove it EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 12 Figure39 Pull up the PSU and remove it Figure40 Loose 4 screws from PSU cage and remove it Figure41 Cut the cable tie Figure42Disconnect the fan cable from PSU EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 13 Figure43 Loose 4 screws from the PSU PCA and remove it Figure44 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it Figure45 Heat the solder of Electrolytic Capacitors greater Figure46 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it(Gamay than 2.5cm in diameter or height and remove it(Gamay 300W REG PSU-Bestec)
  • Page 14 Figure47 Heat the solder of Electrolytic Capacitors greater Figure48 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it(Gamay than 2.5cm in diameter or height and remove it(Gamay 300W REG PSU-Chicony) 300W APFC PSU-Acbel) Figure49 Heat the solder of Electrolytic Capacitors greater Figure50 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it(Gamay...
  • Page 15 Figure51 Heat the solder of Electrolytic Capacitors greater Figure52 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it (Gamay than 2.5cm in diameter or height and remove it (Gamay 300W REG PSU- Liteon) 300W APFC PSU-Delta) Figure53 Heat the solder of Electrolytic Capacitors greater Figure54 Heat the solder of Electrolytic Capacitors greater...
  • Page 16 EL-MF877-00 Page 16 Template Revision B PSG instructions for this template are available at EL-MF877-01...