Requirements On Pcb Layout; Huawei Proprietary And Confidential; Assembly Processes; General Description Of Assembly Processes - Huawei ME909u-523 Hardware Manual

Lte lga module

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HUAWEI ME909u-523 LTE LGA Module

Hardware Guide

6.7.5 Requirements on PCB Layout

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It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For

the stencil design. See the following figure:

Issue 01 (2014-05-24)

To reduce deformation, a thickness of at least 1.0 mm is recommended.

Other devices must be located more than 3 mm (5 mm recommended) away from

the LGA module. The minimum distance between the LGA module and the PCB

edge is 0.5 mm.

When the PCB layout is double sided, it is recommended that the LGA module be

placed on the second side for assembly; so as to avoid module dropped from

PCB or component (located in module) re-melding defects caused by uneven

weight.

Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

Reflow ovens with at least seven temperature zones are recommended.

Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

Mechanical Specifications

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