Huawei ME909u-523 Hardware Manual page 22
Lte lga module
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Also See for ME909u-523:
- Hardware migration manual (70 pages) ,
- Application manual (104 pages) ,
- Acceptance inspection manual (12 pages)
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HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
PIN
Pin Name
No.
118
NC
119
NC
120
NC
121
GND
122
GND
123
GND
124
GND
125
GND
126
GND
127
GND
128
GND
129
GND
130
GND
131
GND
Issue 01 (2014-05-24)
Pad
Description
Type
-
Not connected,
please keep this pin
open.
-
Not connected,
please keep this pin
open.
-
Not connected,
please keep this pin
open.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Parameter
Min. (V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ. (V)
Max. (V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
22
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