Huawei ME909u-523 Hardware Manual page 23
Lte lga module
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Also See for ME909u-523:
- Hardware migration manual (70 pages) ,
- Application manual (104 pages) ,
- Acceptance inspection manual (12 pages)
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HUAWEI ME909u-523 LTE LGA Module
Hardware Guide
PIN
Pin Name
No.
132
GND
133
GND
134
GND
135
GND
136
GND
137
GND
138
GND
139
GND
140
GND
141
GND
142
GND
143
GND
144
GND
145
GND
Issue 01 (2014-05-24)
Pad
Description
Type
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
G
Thermal Ground
Pad, this pad needs
thermal via.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Parameter
Min. (V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ. (V)
Max. (V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
23
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