Customer Pcb Design; Pcb Surface Finish - Huawei MU709 Series Hardware Manual
Hspa+ lga module
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Also See for MU709 Series:
- Hardware manual (63 pages) ,
- Design manual (18 pages) ,
- Development kit manual (35 pages)
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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
The following figure shows the packaging.
6.6 Customer PCB Design
6.6.1 PCB Surface Finish
The PCB surface finish recommended is Electroless Nickel Immersion Gold (ENIG).
Organic Solderability Preservative (OSP) may also be used, ENIG preferred.
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Mechanical Specifications
68
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