Power Interface; Overview - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Pin Pad
Pin Name
No. Type
132 GND -
133 GND -
134 GND -
135 GND -
136 GND -
137 GND -
138 GND -
139 GND -
140 GND -
141 GND -
142 GND -
143 GND -
144 GND -
145 GND -

3.3 Power Interface

3.3.1 Overview

The power supply part of the MU709 module contains:




Table 3-2 lists the definitions of the pins on the power supply interface.
Issue 09 (2017-12-15)
Description
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates

power input pins; PO indicates power output pins.
V indicates low-level input voltage; V

IL
low-level output voltage; V
 The NC (Not Connected) pins are floating and there are no signal connected to these pins.
 The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact us for more details about this
information.
VBAT pins for the power supply
VCC_EXT1 pin for external power output with 1.8 V
USIM_VCC pin for USIM card power output
SD_VCC pin for SD card power output for debugging.
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Description of the Application Interfaces
Min.
Parameter
(V)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
indicates high-level input voltage; V
IH
indicates high-level output voltage.
OH
Typ. Max.
Comments
(V) (V)
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
indicates
OL
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