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Removal procedure
1. Turn the fastening ring on each sensor head connection cable connector in the
direction of the arrow to loosen.
2. Grasp each connector on the sensor head connection cable and pull out to re-
move.
2
When disconnecting, always make sure that the fastening ring has been complete-
ly loosened before pulling out the cable. Risk of damage if you pull the cable with
excessive force (15N or more) with the fastening ring tightened.
6
BEAM ALIGNMENT AND REFERENCE WAVEFORM REGISTRATION
● When installing the product, always register a reference waveform. If a reference
waveform is not registered, correct measurement will not be possible.
● Register the reference waveform without a measurement object.
● When detecting a measurement object with a regular reflection component such
as glass or a mirror surface, reflected light from the measurement object may
prevent correct detection. In this event, mount the emitter and receiver pair at an
angle so that the reflected light does not enter the emitter or reflector. After ad-
justing the angle, always perform beam alignment.
<Beam alignment>
● Check the beam alignment indicator (orange / green) on the receiver as you align
the beam.
● You can also check the state of the emitter / receiver beam on the digital display
of the controller.
Alignment procedure
1. Move the receiver to align the beam while checking the beam alignment indicator
(orange / green) on the receiver.
If the laser is not incident on the receiver, the beam alignment indicator will not
light.
2. If the beam is skewed toward the TOP, only the TOP beam alignment indicator
(green) will light.
If the beam is skewed toward the BOTTOM, only the BOTTOM beam alignment
indicator (green) will light.
TOP: Lights green
BOTTOM: Green OFF
3. When the emitter / receiver beam is correctly aligned, both the TOP and BOTTOM
beam alignment indicators (green) will light.
<Reference waveform registration>
● You can perform reference waveform registration by pressing the ENTER key on
the controller with the beam correctly aligned. The reference waveform is stored
in EEPROM in the receiver.
Note: For detailed information on beam alignment and waveform registration, refer to the "HG-T Series User's Manu-
al" (our Website: https://panasonic.net/id/pidsx/global ).
7
CAUTIONS
The HG-T□ Sensor Head is designed to be used in combination with an HG-TC□ Controller.
If used with a separately purchased dedicated controller, the specifications will not be met
and product malfunctioning or damage may occur.
● This product has been developed / manufactured for industrial use only.
● The receiver in this product uses an EEPROM. The EEPROM has a service life of one mil-
lion setting operations.
● Do not use this product outside the range of the specifications. Risk of an accident and
product damage. There is also a risk of a noticeable reduction of service life.
● To ensure performance, do not use the product after turning ON the power until it has
warmed up for at least 30 minutes.
● Do not wire in parallel with a high-voltage line or power line, or run through the same con-
duit. Risk of malfunctioning due to induction.
● Do not apply stress such as excessive bending or pulling to the extracted part of a cable.
● Do not touch or allow any foreign objects to enter the terminal inside the connector.
1
1
2
2
2
Beam alignment indicator / TOP
Beam alignment indicator / BOTTOM
TOP: Green OFF
BOTTOM: Lights green
TOP: Lights green
BOTTOM: Lights green
● Do not allow ambient light such as sunlight to directly enter the sensor head receiver. When
precision is particularly required, take measures such as attaching a shield to the sensor
head.
● Avoid use in a location subject to sudden temperature changes that cause condensation.
● This product is suitable for indoor use only.
● Avoid dust, dirt, and steam.
● Do not use in a location where there are corrosive or other harmful gases.
● Ensure that the product does not come into contact with organic solvents such as thinner.
● Ensure that the product does not come into contact with strong acid or alkaline.
● Ensure that the product does not come into contact with oil or grease.
● The product cannot be used in an environment that contains flammable or explosive gases.
● Performance may not be satisfactory in a strong electromagnetic field.
● Do not use the product in a location subject to intense vibration or shock.
● The connectors are not structurally dustproof, waterproof, or corrosion-resistant. Do not
use the product underwater or in the rain. Take care of the usage environment.
● This product is a precision device. Do not drop or otherwise subject to shock. Risk of prod-
uct damage.
● Never attempt to disassemble, repair, or modify the product.
● When the product becomes unusable or unneeded, dispose of the product appropriately as
industrial waste.
8
SPECIFICATIONS
Type
Model No.
Combined controller
Position detection method
Installation distance
Measurement width
Red semiconductor laser Class 1 [JIS / IEC / GB / FDA (Note 1)]
Light source
Maximum output: 0.3mW, Peak emission wavelength: 655nm
Repeatability (Note 2)
Linearity (Note 3)
Minimum sensing object (Note 4)
Temperature characteristic
(Note 5)
Protection
Pollution degree
Ambient temperature
-10 to +45°C (No condensation or icing), Storage: -20 to +60°C
Ambient humidity
Ambient illuminance
Incandescent light: 5,000lx at the light-receiving face (Note 6)
Operating altitude
Grounding method
Material
Case: Aluminum die-casting, Light emitting / receiving faces: Glass
Cable
Attached 0.2m shielded cable with 4-conductor type, round connector
Weight
Specification figures are based on the digital measurement values obtained with a sensor combined with an HG-TC□ controller.They
were measured under the following condition unless otherwise specified.
• Ambient temperature : +20°C
• Average controller count setting: 16 times
• Measurement object : Opaque knife edge
• Measurement object position condition: Light half-blocked at the center of 100-mm installation distance
Notes: 1) This is based on the FDA Standard, according to Laser Notice No. 50 of the FDA Standard.
2) P-P value of deviations in digital measurements obtained with light half-blocked at the center of installation distance
3) Indicates the error from the ideal line formed by digital measurements.
4) When light is light blocked at the center of 500-mm installation distance.
5) When light is light half-blocked at the center of 100-mm installation distance.
6) When the sampling cycle of the controller is set to "Standard Sampling". For detailed information, refer to the "HG-T Se-
ries User's Manual" (our Website: https://panasonic.net/id/pidsx/global ).
7) Do not use or store in an environment that has been pressurized to an air pressure higher than the atmospheric pressure
at 0m.
9
SIDE VIEW ATTACHMENT (OPTIONAL)
● When attaching the Side View Attachment to the emitter, make sure that beam
alignment can be performed.
● After mounting the Side View Attachment to the sensor head, check whether the
beam axis of the sensor head is aligned. After checking the beam axis, register
the reference waveform and conduct operation check.
● By attaching the Side View Attachment HG-TSV10 (optional) to the product, you
can change the laser light emission direction.
● To attach the HG - TSV 10 to the product, use the included setscrew (M2 screw
with washer, length: 4 mm). Tighten the screw with a torque of 0.088 N·m or less.
Sensor head
Side View Attachment
HG-TSV10 (Optional)
M2 screw with captive washer
(length 4mm)
(Included with HG-TSV10)
Notes: 1) HG-TSV10 is sold individually. Two HG-TSV10 units are required when installing to both emitter and receiver.
● Specifications
Model No.
Combined sensor head
Material
Accessory
Set screw (M2 screw with washer, length: 4 mm): 2 pcs.
Weight
Notes: 1) Cannot be attached to the sensor head HG-T1110 (measurement width:10mm / slim type).
https://panasonic.net/id/pidsx/global
Overseas Sales Division (Head Office)
2431-1 Ushiyama-cho, Kasugai-shi, Aichi, 486-0901, Japan
Phone: +81-568-33-7861 FAX: +81-568-33-8591
For sales network, please visit our website.
PRINTED IN JAPAN
Measurement width:10mm / standard type
HG-T1010
HG-TC□
CMOS method
0 to 500mm
10mm
1µm (at an installation distance of 20mm)
2.5µm (at an installation distance of 100mm)
5µm (at an installation distance of 500mm)
±0.12% F.S. (at an installation distance of 20mm)
±0.28% F.S. (at an installation distance of 100mm)
ø0.5mm (at an installation distance of 500mm)
±0.03% F.S./°C
IP67 (IEC) (excluding the connector)
2
35 to 85% RH, Storage: 35 to 85% RH
2,000m or less (Note 7)
Capacitor grounding
Emitter : 30 g approx., Receiver : 30 g approx.
Example of HG-TSV10
installation on both unit
HG-TSV10 (Optional)
HG-TSV10 (Optional)
Emitter
Receiver
HG-TSV10
HG-T1010(Note 1)
Main unit: LCP, optical surface: glass
Approx. 2g
© Panasonic Industrial Devices SUNX Co., Ltd. 2019
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