Huawei MU509 Hardware Migration Manual page 34

HUAWEI 30 mm × 30 mm LGA Module
Hardware Migration Guide
Figure 2-17 The matching network for MAIN_ANT
To implement 50 Ω impedance, the designer should adjust the components G_C1,
G_L1, G_L2 and G_C2 shown in the preceding figure as required.
RF Interface Design for Modules
The recommended RF Pad design is shown as follows for different modules selection.
Please note that the Pad and RF trace design changes in the main board.
Figure 2-18 RF Pad design for different modules selection (Top view of LGA)
RF Trace Design
Take pin 107 for example (Top view of LGA and the main board):
Issue 08 (2016-12-12)
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LGA Interface Differences
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