Huawei MU739 Hardware Manual page 6

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
4.1 About This Chapter ......................................................................................................................... 39
4.2 Antenna Installation Guidelines ...................................................................................................... 39
4.3 Operating Frequencies ................................................................................................................... 39
4.4 Conducted RF Measurement ......................................................................................................... 40
4.4.1 Test Environment ................................................................................................................... 40
4.4.2 Test Standards ....................................................................................................................... 40
4.5 Conducted Rx Sensitivity and Tx Power ........................................................................................ 40
4.5.1 Conducted Receive Sensitivity .............................................................................................. 40
4.5.2 Conducted Transmit Power ................................................................................................... 41
4.6 Antenna Design Requirements ...................................................................................................... 42
4.6.1 Antenna Design Indicators..................................................................................................... 42
4.6.2 Interference ........................................................................................................................... 44
4.6.3 GSM/WCDMA Antenna Requirements .................................................................................. 44
4.6.4 Radio Test Environment ........................................................................................................ 45
5 Electrical and Reliability Features ........................................................................................... 47
5.1 About This Chapter ......................................................................................................................... 47
5.2 Absolute maximum ratings ............................................................................................................. 47
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 48
5.4 Electrical Features of Application Interfaces .................................................................................. 48
5.5 Power Supply Features .................................................................................................................. 51
5.5.1 Input Power Supply ............................................................................................................... 51
5.5.2 Power Consumption .............................................................................................................. 51
5.6 Reliability Features ......................................................................................................................... 55
5.7 EMC and ESD Features ................................................................................................................. 56
6 Mechanical Specifications ......................................................................................................... 58
6.1 About This Chapter ......................................................................................................................... 58
6.2 Dimensions and Interfaces ............................................................................................................. 58
6.3 Customer PCB Pad Design ............................................................................................................ 60
6.4 Label ............................................................................................................................................... 60
6.5 Packing System.............................................................................................................................. 61
7 Certifications ................................................................................................................................ 62
7.1 About This Chapter ......................................................................................................................... 62
7.2 Certifications ................................................................................................................................... 62
7.3 Environmental Protection Certification and Test ............................................................................ 63
7.3.1 RoHS ..................................................................................................................................... 63
7.3.2 WEEE .................................................................................................................................... 63
7.3.3 PVC-free ................................................................................................................................ 64
7.3.4 Packaging .............................................................................................................................. 64
7.4 National Compulsory Certification .................................................................................................. 64
7.4.1 Product Certification .............................................................................................................. 64
7.4.2 Importance of Product Certification ....................................................................................... 64
Issue 01 (2011-08-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
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