Production Guidance; Reflow Soldering Temperature; Reflow Curving Diagram - Ebyte E01 Series User Manual

nRF24L01P wireless module
take measures such as shielding to reduce the influence of harmonic interference and inter-modulation interference.
[Crystal] If there is a crystal near the circuit board on the module, increase the linear distance between the crystal and circuit board as much as
possible.

7. Production Guidance

7.1.

Reflow Soldering Temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
7.2.

Reflow Curving Diagram

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Curve characteristics
Solder paste
Mini. preheating temperature
Max. preheating temperature
Preheating time
Average rising rate
Liquidus temperature
The time above the liquidus
Peak temperature
Average rate of decline
The time from 25℃ to peak temperature
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E01 series user manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max