Huawei MU709Gs-8 Quick Start Manual page 8

Reflow Profile
For the soldering temperature of the LGA module, see the following figure.
Reflow parameters
Temperature Zone
Preheat zone (40°C–150°C)
Reflow profile
Time
60s–120s
5
Key Parameter
Heating rate:
0.5°C/s–2°C/s