Motorola R-2400 Operator's Manual page 11

9.
when
replacing
a cMos
integrated circuit
device, leave the
device in its metal rail container or con-
ductive foam until it
is to
be
inserted into
the
printed
cir-
cuit module.
device
inputs after power is applied
to
the
cMoS
cir-
cuitry. Similarly,
such
low impedance
equipment should
be
disconnected before power
is
turned
off.
I
l.
Replacement modules shipped
separately from
the factory
will
be packaged
in
a conductive material.
Any
modules being transported from one
area to
another should
be
wrapped
in a
simlar
material
(aluminum
foil
may be
used). NEVER
usE
NoN-
coNDUcTIVE MATERIAL
for
packaging
these
modules.
10.
All
low
impedance
test
pulse generators,
etc.) should
be
equipment (such
as
connected
to
CMOS
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A
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