Texas Instruments MSP430C311S Manual
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Texas Instruments MSP430C311S Manual

Texas Instruments MSP430C311S Manual

Mixed signal microcontrollers
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D
Low Supply Voltage Range 2.5 V − 5.5 V
D
Ultra Low-Power Consumption
D
Low Operation Current, 400 μA at 1 MHz,
3 V
D
Five Power Saving Modes: (Standby Mode:
1.3 μA, RAM Retention/Off Mode: 0.1 μA)
D
Wakeup From Standby Mode in 6 μs
Maximum
D
16-Bit RISC Architecture, 300 ns Instruction
Cycle Time
D
Single Common 32 kHz Crystal, Internal
System Clock up to 3.3 MHz
D
Integrated LCD Driver for up to 64 or 92
Segments
D
Slope A/D Converter With External
Components
D
Serial Onboard Programming
D
Program Code Protection by Security Fuse
D
Family Members Include:
MSP430C311S: 2k Byte ROM, 128 Byte RAM
MSP430C312: 4k Byte ROM, 256 Byte RAM
MSP430C313: 8k Byte ROM, 256 Byte RAM
MSP430C314: 12k Byte ROM, 512 Byte RAM
MSP430C315: 16k Byte ROM, 512 Byte RAM
MSP430P313: 8k Byte OTP, 256 Byte RAM
MSP430P315: 16k Byte OTP, 512 Byte RAM
MSP430P315S: 16k Byte OTP, 512 Byte RAM
D
EPROM Version Available for Prototyping :
PMS430E313FZ
D
Available in:
56-Pin Plastic Small-Outline Package
(SSOP),
48-Pin SSOP (MSP430C311S,
MSP430P315S),
68-Pin J-Leaded Ceramic Chip Carrier
(JLCC) Package (EPROM Only)
description
The MSP430 is an ultralow-power mixed signal microcontroller family consisting of several devices that feature
different sets of modules targeted to various applications. The microcontroller is designed to be battery operated
for an extended application lifetime. With 16-bit RISC architecture, 16-bit integrated registers on the CPU, and
a constant generator, the MSP430 achieves maximum code efficiency. The digitally-controlled oscillator,
together with the frequency-locked-loop (FLL), provides a wakeup from a low-power mode to active mode in
less than 6 ms.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
†
MSP430P313/E313 not recommended for new designs − replaced by MSP430P315/E315.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
†
†
, PMS430E315FZ
POST OFFICE BOX 655303
POST OFFICE BOX 1443
MIXED SIGNAL MICROCONTROLLERS
SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000
TDO/TDI
TDI/VPP
TMS
TCK
RST/NMI
XBUF
V
SS
V
CC
R23
R13
Xin
Xout/TCLK
P0.0
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
CIN
NC
TDI/VPP
TMS
TCK
RST/NMI
XBUF
V
SS
V
CC
R23
R13
Xin
Xout/TCLK
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
NC
TP0.0
TP0.1
TP0.2
TP0.3
TP0.5
CIN
NC − No internal connection
Copyright © 2000, Texas Instruments Incorporated
•
DALLAS, TEXAS 75265
•
HOUSTON, TEXAS 77251−1443
MSP430x31x
DL PACKAGE
(56-PIN TOP VIEW)
1
56
NC
COM3
2
55
3
54
COM2
4
53
COM1
5
52
COM0
6
51
S27/O27/CMPI
7
50
S26/O26
8
49
S23/O23
9
48
S22/O22
10
47
S18/O18
11
46
S17/O17
12
45
S16/O16
13
44
S15/O15
14
43
S14/O14
15
42
S13/O13
16
41
S12/O12
17
40
S11/O11
18
39
S10/O10
19
38
S9/O9
20
37
S8/O8
21
36
S7/O7
22
35
S6/O6
23
34
S5/O5
24
33
S4/O4
25
32
S3/O3
26
31
S2/O2
27
30
S1
28
29
S0
DL PACKAGE
(48-PIN TOP VIEW)
TDO/TDI
1
48
2
47
COM3
COM2
3
46
4
45
COM1
5
44
COM0
6
43
S27/O27/CMPI
7
42
NC
8
41
V
SS
9
40
NC
10
39
S16/O16
11
38
S15/O15
12
37
S14/O14
13
36
S13/O13
14
35
S12/O12
15
34
S11/O11
16
33
S10/O10
17
32
S9/O9
18
31
S8/O8
19
30
S7/O7
20
29
S6/O6
21
28
S5/O5
22
27
S4/O4
23
26
S3/O3
24
25
S2/O2
1

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Summary of Contents for Texas Instruments MSP430C311S

  • Page 1 6 ms. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. † MSP430P313/E313 not recommended for new designs − replaced by MSP430P315/E315.

  • Page 2: Functional Block Diagram

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 description (continued) Typical applications include sensor systems that capture analog signals, converting them to digital values, and then processes the data and displays them or transmits them to a host system. The timer/port module provides single-slope A/D conversion capability for resistive sensors.

  • Page 3: Terminal Functions

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 Terminal Functions † MSP430C312, MSP430C313 , MSP430C314, MSP430C315, MSP430P313 , MSP430P315 † 56-pin SSOP package TERMINAL DESCRIPTION DESCRIPTION NAME Counter enable. CIN input enables counter (TPCNT1) (timer/port). COM0 −COM3 52 −55 Common output pins.
  • Page 4 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 functional block diagram MSP430C311S and MSP430P315S V CC V SS Xout XBUF RST/NMI P0.1−6 2 kB Oscillator ACLK 128/512B Power-On- 8-bit Timer/ I/O Port 16 kB Counter Reset 6 I/O’s, All With...
  • Page 5 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 Terminal Functions MSP430C311S, MSP430P315S 48-pin SSOP package TERMINAL DESCRIPTION DESCRIPTION NAME Counter enable. CIN input enables counter (TPCNT1) (timer/port). COM0 −COM3 44 −47 Common output pins, COM0 −COM3 are used for LCD back planes.
  • Page 6 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 short-form description processing unit The processing unit is based on a consistent and orthogonal designed CPU and instruction set. This design structure results in a RISC-like architecture, highly transparent to the application development and distinguishable by the ease of programming.
  • Page 7 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 Table 2. Address Mode Descriptions ADDRESS MODE SYNTAX EXAMPLE OPERATION √ √ R10 → R11 Register MOV Rs, Rd MOV R10, R11 √ √ M(2 + R5) → M(6 + R6) Indexed MOV X(Rn), Y(Rm) MOV 2(R5), 6(R6)
  • Page 8 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 operation modes and interrupts (continued) The most general bits that influence current consumption and support fast turn-on from low power operating modes are located in the status register (SR). Four of these bits control the CPU and the system clock generator: SCG1, SCG0, OscOff, and CPUOff.

  • Page 9: Special Function Registers

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 special function registers Most interrupt and module enable bits are collected into the lowest address space. Special function register bits that are not allocated to a functional purpose are not physically present in the device. Simple software access is provided with this arrangement.

  • Page 10: Memory Organization

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 memory organization MSP430C311S MSP430C312 MSP430C313 MSP430C314 MSP430C315 FFFFh FFFFh FFFFh FFFFh FFFFh Int. Vector Int. Vector Int. Vector Int. Vector Int. Vector FFE0h FFE0h FFE0h FFE0h FFE0h FFDFh...
  • Page 11 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 peripherals Peripherals connected to the CPU through a data, address, and control busses can be handled easily with instructions for memory manipulation. oscillator and system clock Two clocks are used in the system: the system (master) clock (MCLK) and the auxiliary clock (ACLK). The MCLK is a multiple of the ACLK.
  • Page 12 SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 peripherals (continued) digital I/O There is one eight-bit I/O port, Port0, that is implemented (MSP430C311S and MSP430P315S have six bits available on external pins). Six control registers give maximum digital input/output flexibility to the application: •...
  • Page 13 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 peripherals (continued) slope A/D conversion Slope A/D conversion is accomplished with the timer/port module using external resistor(s) for reference (R external resistor(s) to the measured (R ), and an external capacitor. The external components are driven meas by software in such a way that the internal counter measures the time that is needed to charge or discharge the capacitor.

  • Page 14: Peripheral File Map

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 8-Bit Timer/Counter (continued) Two counter inputs (load, enable) control the counter operation. The load input controls load operations. A write-access to the counter results in loading the content of the preload-register into the counter. The software writes or reads the preload-register with all instructions.

  • Page 15: Absolute Maximum Ratings

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 † absolute maximum ratings Voltage applied at V to V ............−0.3 V to 6 V Voltage applied to any pin (referenced to V .
  • Page 16 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 f(MHz) Minimum − Supply Voltage − V NOTE: Minimum processor frequency is defined by system clock. Figure 2. Processor Frequency vs Supply Voltage, P/E Versions electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) supply current (into V ) excluding external current (f...
  • Page 17 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) current consumption of active mode versus system frequency, C versions only × f [MHz] AM[1 MHz] system current consumption of active mode versus supply voltage, C versions only + 200 μA/V ×...
  • Page 18 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) optional resistors, individually programmable with ROM code, P0.x, (see Note 10) PARAMETER TEST CONDITIONS UNIT = 3 V/5 V kΩ...
  • Page 19 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 electrical characteristics over recommended and operating free-air temperature range (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS UNIT = 1A0h FN_4=FN_3=FN_2=0 = 3 V/5 V (NOM) = 3 V 0.15 = 00 0110 0000 FN_4=FN_3=FN_2=0 00 0110 0000 FN 4 FN 3 FN 2 0...
  • Page 20 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS UNIT −V )× Voltage at R23 = 3 V/5 V 2/3+V Analog voltage Analog voltage ) ×...
  • Page 21 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 (POR) No POR (min) Figure 4. Power-On Reset (POR) vs Supply Voltage 25°C −40 −20 Temperature [°C] Figure 5. V vs Temperature (POR) wakeup from LPM3 PARAMETER TEST CONDITIONS UNIT = 3 V f = 1 MHz...
  • Page 22 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) JTAG, program memory PARAMETER TEST CONDITIONS UNIT = 3 V TCK frequency TCK frequency (TCK) = 5 V JTAG/Test JTAG/Test Pullup resistors on TMS, TCK, TDI...

  • Page 23: Typical Characteristics

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 TYPICAL CHARACTERISTICS JTAG fuse check mode MSP430 devices that have the fuse on the TDI/VPP terminal have a fuse check mode that tests the continuity of the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check current, I , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TDI/VPP pin to ground if the fuse is not burned.

  • Page 24: Supply Voltage

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 TYPICAL CHARACTERISTICS DIGITAL CONTROLLED OSCILLATOR FREQUENCY DIGITAL CONTROLLED OSCILLATOR FREQUENCY SUPPLY VOLTAGE OPERATING FREE-AIR TEMPERATURE −40 −20 − Supply Voltage − V T − Operating Free-Air Temperature − °C Figure 7 Figure 8 •...
  • Page 25 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 TYPICAL CHARACTERISTICS typical input/output schematics (see Note A) (see Note A) (see Note B) (see Note B) (see Note B) (see Note B) (see Note A) (see Note A) CMOS INPUT (RST/NMI) CMOS SCHMITT-TRIGGER INPUT (CIN) (see Note A)
  • Page 26 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 TYPICAL CHARACTERISTICS typical input/output schematics COM0 −3 Control COM0 −3 S0, S1 Segment control S2/O2−Sn/On Segment control LCDCTL (LCDM5,6,7) Data (LCD RAM bits 0−3 or bits 4 −7) LCD OUTPUT (COM0 −4, Sn, Sn/On) NOTE: The signals VA, VB, VC, and VD come from the LCD module analog voltage generator.
  • Page 27 MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 † PMS430E313 , PMS430E315 (FZ package) FZ PACKAGE (TOP VIEW) 6 5 4 1 68 67 66 65 64 63 62 61 S23/O23 S22/O22 S18/O18 S17/O17 S16/O16 Xout/TCLK S15/O15 P0.0 S14/O14...

  • Page 28: Mechanical Data

    MSP430x31x MIXED SIGNAL MICROCONTROLLERS SLAS165D − FEBRUARY 1998 − REVISED APRIL 2000 MECHANICAL DATA FZ (S-CQCC-J**) J-LEADED CERAMIC CHIP CARRIER 28 LEAD SHOWN 0.040 (1,02)  45° Seating Plane 0.180 (4,57) 0.155 (3,94) 0.140 (3,55) 0.120 (3,05) 0.050 (1,27) (at Seating 0.032 (0,81) Plane) 0.026 (0,66)
  • Page 29 PACKAGE OPTION ADDENDUM www.ti.com 2-Mar-2014 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) MSP430P313IDL OBSOLETE SSOP Call TI Call TI M430P313 MSP430P315IDL OBSOLETE SSOP Call TI Call TI...
  • Page 30 PACKAGE OPTION ADDENDUM www.ti.com 2-Mar-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

  • Page 33: Important Notice

    IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.

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