Advertisement
Bottom Side Alignment
The wafer is aligned to the mask using the bottom side alignment
microscope (BSA).
1. Adjust Parameters
a. Make secure that no mask is loaded before select mask
loading manual.
b. Deactivate BSA MICROSCOPE key (LED off).
c. Press EDIT PARAMETER key to edit the parameter
exposure time, alignment gap and WEC type. Change all
necessary value and confirm by pressing EDIT
PARAMETER key again.
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder.
c. Toggle the mask vacuum on by pressing
ENTER key.
d. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer Chuck for BSA
a. Insert a proper chuck without wafer onto the transport
slide.
b. Move the BSA-chuck placed onto the transport slide into
the machine. Don't press a key.
4. Microscope Alignment
a. Turn the SPLITFIELD switch to middle position and toggle
BSA MICROSCOPE key on (LED on). This key enables
the microscope manipulators accordingly.
b. Turn the ILLUMINATION switch to BSA/IR and adjust the
light intensity by the potentiometers labeled BSA/IR
microscope illumination left/right.
c. Make secure the TOP/BOTTOM key LED is on and adjust
the fine focus separately with the TOP SUBSTRATE
LEFT/RIGHT regulators.
d. Select one of keys LEFT, BOTH, RIGHT to move the
left/right objective with the ARROW keys. If necessary
use fast speed (FAST key LED on).
Zx
Advertisement
