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Top Side Alignment
In this mode the wafer is aligned to the mask using the top side
alignment microscope (TSA).
1. Adjust Parameters
a. Make secure that no mask is loaded before select mask
loading manual.
b. Deactivate BSA MICROSCOPE key (LED off).
c. Press EDIT PARAMETER key to edit the parameter
exposure time, alignment gap and WEC type. Change all
necessary value and confirm by pressing EDIT
PARAMETER key again
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder. Toggle the mask
vacuum on by pressing ENTER key.
c. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer
a. The machine instructs: "pull slide and load substrate onto
chuck". Pull out the transport slide completely. Insert the
proper chuck and place the wafer against the pre-
alignment pins. Confirm with ENTER key. Now the wafer
is hold by vacuum.
b. The machine instructs: "move slide into machine and
confirm with ENTER". Move slide in and press ENTER
key.
c. Wedge error compensation (WEC) starts automatically
after the last action is completed. The wafer is adjusted
parallel to the mask.
4. Microscope Alignment
a. Verify BSA MICROSCOPE key off.
b. Set SPITFIELD switch to the required position.
c. Adjust illumination with the aperture located at the
left/right microscope front.
d. Focus on the mask plane.
Zx
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