Xsens MTi-1 Integration Manual
Mti-1 series
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Hardware Integration Manual
Xsens Technologies B.V.
Pantheon 6a
phone
P.O. Box 559
fax
7500 AN Enschede
e-mail
The Netherlands
internet
Xsens North America, Inc.
+31 (0)88 973 67 00
10557 Jefferson Blvd,
+31 (0)88 973 67 01
Suite C
info@xsens.com
CA-90232 Culver City
www.xsens.com
USA
MTi 1-series
Document MT1503P, Revision A, 5 Apr 2018
phone
fax
e-mail
internet
310-481-1800
310-416-9044
info@xsens.com
www.xsens.com
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Table of Contents
Related Manuals for Xsens MTi-1
Summary of Contents for Xsens MTi-1
- Page 1 Hardware Integration Manual MTi 1-series Document MT1503P, Revision A, 5 Apr 2018 Xsens Technologies B.V. Xsens North America, Inc. Pantheon 6a phone +31 (0)88 973 67 00 10557 Jefferson Blvd, phone 310-481-1800 P.O. Box 559 +31 (0)88 973 67 01...
- Page 2 05 Apr 2018 Initial release © 2005-2018, Xsens Technologies B.V. All rights reserved. Information in this document is subject to change without notice. Xsens, MVN, MotionGrid, MTi, MTx and Awinda are registered trademarks or trademarks of Xsens Technologies B.V. and/or its parent, subsidiaries and/or affiliates in The Netherlands, the USA and/or other countries.
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Page 3: Table Of Contents
RAY PACKAGING INFORMATION ......................16 EEL PACKAGING INFORMATION .......................... 17 ACKAGE DRAWING HANDLING ............................18 ........................18 EFLOW SPECIFICATION ........................18 LTRASONIC PROCESSES (ESD) ......................19 LECTROSTATIC DISCHARGE www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... - Page 4 Figure 15: MTi 1-series v2.0 dimensions and sensor locations ..............17 Figure 16: Location PCB number on MTi 1-series module (bottom view) ............17 Figure 17: Reflow classification profile (not to scale) ................... 18 www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series...
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Page 5: General Information
This number can be found on the packaging label (see Sections 5.1 and 5.2). This number can be found on the bottom side of the MTi 1-series module (see Section 5.3). www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 6: Power Supply
VDDA, the single supply voltage VDD should be at least 2.2 V, due to the voltage drop over R1. Figure 1: External components single supply (I C interface) www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 7: Power Supply Specifications
Table 3: Maximum operating voltage ratings Unit VDDA 2.16 VDDA ripple mVpp VDDIO VDDA + 0.1 Previous generation version ≤1.1, VDDA max: 3.45V www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 8: Interfaces
Figure 2 shows the pin configuration of the MTi 1-series module. Pin 18, 19 and 20 are only used on the MTi-7, for MTi-1/2/3 these pins need not be connected (DNC). Figure 2: Pin configuration of the MTi 1-series module (top view) 3.2 Communication to host... -
Page 9: Psel Serial Host Communication Interface Selection
(30 kΩ – 50 kΩ). Not connecting PSEL results in a value of 1, connecting PSEL to GND results in a value of 0. Table 5: Serial host interface selection Interface PSEL1 PSEL0 UART half-duplex UART full-duplex www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 10: I 2 C
ADD[0..2] = 111. Table 6 shows a list of all possible I C addresses. Table 6: List of I C addresses C address ADD2 ADD1 ADD0 0x1D 0x1E 0x28 0x29 0x68 0x69 0x6A 0x6B (default) www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 11: Spi
CTS line needs to be tied low (GND) to make the MTi 1-series transmit. For UART half-duplex interface, PSEL1 needs to be connected to GND and PSEL0 pin must be left floating (see Table 5). Figure 5: Connections (UART interface full-duplex) www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 12: Gnss Receiver And Barometer Interface
SPI pins need to be connected to the AUX_nCS, AUX_MOSI, AUX_MISO and AUX_SCK pins of the MTi-7 module. See Figure 6 for schematic details. Figure 6: Connections (GNSS interface) www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 13: I/Opins
MTi 1-series and the external device are connected to or have the same common GND. Table 8 shows the electrical specifications. 3.5 DNC/RESERVED pins These pins are reserved for future use. Do not connect, leave pins floating! www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 14: Design
Frames of reference used in MTi 1-series The MTi 1-series module uses a right-handed coordinate system as the basis of the sensor frame. Figure 8: Default sensor fixed coordinate system for the MTi 1-series module www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 15: Origin Of Measurements
The following paragraphs show causes of mechanical stress and ways to reduce it. 4.2.1 Pushbutton contacts Pushbuttons induce mechanical stress when used. Therefore, it is recommended to keep a reasonable distance between a pushbutton and the MTi 1-series module. www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 16: Anchor Points
Figure 12. Figure 11: Reducing anchor points to reduce overall stress in the PCB Figure 12: Keeping the MTi 1-series module away from high mechanical stress areas www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 17: Vibrations
3D magnetometer of the MTi 1-series. Place high current power lines away from the MTi 1-series. Example: a power line with a current of 100 mA at a distance of 10 mm, will introduce an error of 2 µT. www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 18: Footprint
Development Kit). When using a socket, make sure that it supports the maximum dimensions of the MTi 1-series module as given in Section 5.3 (note the tolerance of ± 0.1 mm). Figure 13: Recommended MTi 1-series module footprint www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 19: Packaging
All dimensions are in millimeters. • Pictured tray representative only, actual tray may look different. • The hardware version number is labeled SPEC REV on the TNR Label. www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 20: Reel Packaging Information
4.10 16.10 2.10 13.50 27.40 NOTES: • All dimensions are in millimeters, unless otherwise specified. • The hardware version number is labeled SPEC REV on the TNR Label. www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 21: Package Drawing
Figure 15: MTi 1-series v2.0 dimensions and sensor sensor locations locations All dimensions are in mm. General tolerances are ± 0.1 mm Figure 16: Location PCB number on MTi 1-series module (bottom view) www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series... -
Page 22: Handling
The number of times that MEMS components may be reflowed is limited to three times. As the IMU is already reflowed once by Xsens in order to produce the MTi 1-series module, the MTi 1-series module may only be reflowed two times when placed on the PCB board. If the MTi 1-series is designed-in a double-sided PCB, it is recommended to reflow the side with the MTi 1-series in the second run in order... -
Page 23: Electrostatic Discharge (Esd)
The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment. www.xsens.com Document MT1503P.A © Xsens Technologies B.V. Hardware Integration Manual MTi 1-series...