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( 2 ) Notes on mounting
1. Soldering temperature conditions
If the internal temperature of the package exceeds 260°C, the characteristics of the crystal resonator may deteriorate
and the package may be damaged. Therefore, before using this module, be sure to confirm what temperatures it
will be exposed to during the mounting process. If the mounting temperature conditions are ever changed, the
suitability of those temperature conditions for this package must be confirmed again.
Soldering conditions: Up to 260°C for up to 10 seconds, twice, or up to 230°C for up to 3 minutes.
Example of SMD Product Soldering Conditions
Infrared reflow
° C)
Temp.(
200
1 to 5
100
° C/sec
1 to 5
pre-heating
0
60 sec. min
2. Mounters
While this module can be used with general-purpose mounters, be sure to confirm the force of impact that the
module will be subjected to during mounting, since certain machines or conditions can result in damage to the
internal crystal resonator. If the mounting conditions are ever changed, the suitability of those conditions for this
package must be confirmed again.
3. Ultrasonic cleaning
Under certain conditions, ultrasonic cleaning can damage the crystal resonator. Because we cannot specify the
conditions under which you perform ultrasonic cleaning (including the type of cleaner, the power level, the duration,
the condition of the inside of the chamber, etc.), Seiko-Epson does not warrant this product against ultrasonic
cleaning.
4. Mounting orientation
If this module is mounted backwards, it may be damaged. Always confirm the orientation of the module before
mounting it.
5. Leakage between pins
If power is supplied to this module while it is dirty or while condensation is present, leakage between pins may result.
Be sure that the module is clean and dry before supplying power to it.
10 sec. max
° C max
235
° C/sec
1 to 5
200 sec. max
Time
Vapor phase reflow
° C)
Temp.(
200
° C/sec
100
pre-heating
0
60 sec. min
Page-12
30 sec. max
220
° C/sec
1 to 5
° C/sec
1 to 5
200 sec. max
° C max
° C/sec
1 to 5
Time
Aug.1998
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