Printed Wiring Boards - Base Main Section - Sony SPP-M937 Service Manual

2-line cordless telephone
Hide thumbs Also See for SPP-M937:
Table of Contents

Advertisement

5-6. PRINTED WIRING BOARDS – BASE MAIN SECTION –
2
3
4
1
BASE MAIN BOARD (SIDE A)
A
R138
B
D27
D14
R137
D13
1
U12
2
D16
D28
R231
R233
C
D29
R220
R171
4
3
2
1
U20
U13
1
2
3
4
C100
D
C101
Q15
C112
C97
C91
C93
BCE
C8
BCE
Q14
1
14
U5
5
10
E
7
8
8
7
8
7
10
5
10
5
U14
U19
14
1
14
1
1
14
F
5
10
U18
7
8
1
14
5
10
U17
7
8
G
Q27 BCE
40
35
30
25
41
24
4
1
45
20
U4
15
50
U2
5
8
D17
H
55
10
7
5
1
60
5
U11
64
1
C204
65
70
75
80
8
10
14
R72
I
Q17
1
2
U8
L4
L23
L21
L3
J
02
02
U8
+
K
MIC
CHARGE
TERMINAL
– 27 –
5
6
7
8
9
C5
C4
C2
4
3
14
10
8
U23
BASE RF
C170
BOARD
Q30
Q26
1
5
7
ECB
ECB
C144
BCE
BCE
Q23
Q19
C40
C227
14
10
8
Q13
Q12
U10
BCE
ECB
1
5
7
ECB
Q8
BCE
Q10
Q6
ECB
C145
C95
BCE
Q28
Q1
RV2
C23
12
10
5
1
4
1
U9
U6
5
8
Q22
13 15
20
24
R157
C111
C22
RV1
C30
C79
C18
Q7 BCE
12
10
5
1
Q4
Q5 BCE
BCE
BCE
Q3
U3
C115
13 15
20
24
C74
C78
C77
C76
11
1-679-607-
(11)
10
11
12
13
BASE MAIN BOARD (SIDE B)
L2
L1
1
U1
3
ANT1
+9V
S1
RX AUDIO
DIAL MODE
TONE
RX LOOP VOLTAGE
R
TX LOOP VOLTAGE
PULSE
MIC DISABLE
MIC IN
TX PWR
GND
S3
RINGER LEVEL
L2
HIGH
r
10
1
5
13
LOW
U3
r
OFF
S2
RINGER LEVEL
L1
HIGH
X1
r
LOW
r
OFF
CT220
1
5
10
15
BASE KEY BOARD
A
(Page 35)
– 28 –
14
15
16
17
18
J1
J2
J7
J6
L1/L1+L2
L2
DATA
DC IN 9V
L25
L26
L24
L30
D22
D8
C113
C118
1
4
U7
C94
2
C131
3
C117
C116
T1
T2
TX
GND
TX
AUDIO 1
AUDIO 2
ATE DATA
GND
X2
ATE EN
CRDIN
19
11
1-679-607-
(11)
SPP-M937
Semiconductor Location
z
Ref. No.
Ref. No.
Location
Location
Ref. No.
Location
D8
B-16
U13
D-3
D9
C-15
U14
E-4
D10
C-15
U17
G-2
D11
C-16
U18
F-2
D12
C-16
U19
E-2
D13
B-4
U20
D-3
D14
B-4
U23
C-6
D16
B-4
D17
H-5
D22
B-18
Q1
G-6
Q3
I-6
D23
C-17
Q4
I-6
D24
C-17
Q5
I-5
D25
C-17
Q6
F-7
D26
C-17
D27
B-3
Q7
I-6
Q8
E-6
D28
B-3
Q9
D29
C-3
Q10
F-6
Q12
E-6
U1
B-13
Q13
E-7
U2
H-4
Q14
D-3
U3
I-7
Q15
D-1
U4
H-2
Q17
I-3
U5
E-12
Q19
D-6
U6
H-6
Q22
H-5
U7
C-14
Q23
D-5
U9
H-8
Q26
D-5
U10
E-7
Q27
G-5
U11
H-2
Q28
G-5
U12
B-5
Q30
D-5
Note:
• X : parts extracted from the component side.
: Through hole.
z
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
– 29 –

Advertisement

Table of Contents
loading

Table of Contents