Table of Contents
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TABLE OF CONTENTS
Specifications ........................................................................... 1
1. GENERAL
Identifying the parts ........................................................... 3
Step 2 : Setting up the base phone ..................................... 3
Step 3 : Preparing the battery pack .................................... 4
Making calls ....................................................................... 5
Receiving calls ................................................................... 5
Speed dialing ...................................................................... 6
Setting the ringer type ........................................................ 7
Switching the phones during a call .................................... 7
Talking between the handset and
the base phone (Intercom) ........................................... 8
Transferring a call .............................................................. 8
Having a conference call .................................................... 9
Mounting the base phone on a wall ................................. 10
Carrying the handset by the belt clip ............................... 10
2-1. Hand Rear ................................................................. 11
2-2. Hand Main Board, Hand RF Board .......................... 11
2-3. Base bottom .............................................................. 12
2-4. Base Top ................................................................... 12
Base Key Board ........................................................ 13
................................................................ 14
4. ELECTRICAL ADJUSTMENTS
4-1. Base Unit Section ..................................................... 15
4-2. Handset section ......................................................... 16
5-1. Block Diagrams - Base Unit Section (1/2) - ......... 17
5-2. Block Diagrams - Base Unit Section (2/2) ............ 19
5-3. Block Diagrams - Han Main Section - .................. 21
5-4. Schematic Diagram -Base Unit Section (1/2) - ..... 23
5-5. Schematic Diagram - Base Unit Section (2/2) - .... 25
5-6. Printed Wiring Boards - Base Main Section- ........ 27
5-7. Schematic Diagram - Hand Main Section - .......... 30
5-8. Printed Wiring Board - Hand Main Section - ........ 33
5-9. Printed Wiring Board - Base Key Section - .......... 35
5-10. Schematic Diagram - Base Key Section - ............. 36
5-11. Explanation of IC terminals .................................... 37
6-1. Handset Section ........................................................ 41
6-2. Base Unit Section ..................................................... 42
.................................... 43
- 2 -
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTE WHEN REPAIRING/REPLACING THE EEPROM
This model is used two EEPROMs of U4(Base unit) and
U3(Handset).
Therefore, the EEPROM must change two pieces together since
it's supply two pieces in one package as a spare parts (X-3379-
672-1).
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
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