Texas Instruments SN74LVC2G241 Manual page 19

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YZP0008
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
B
E
BALL A1
CORNER
0.5 MAX
0.19
0.15
BALL TYP
D
C
1.5
TYP
B
0.5
TYP
A
0.25
8X
1
0.21
0.015
C A B
SYMM
DSBGA - 0.5 mm max height
SCALE 8.000
A
D
C
SEATING PLANE
0.05 C
0.5 TYP
SYMM
D: Max =
E: Max =
2
www.ti.com
PACKAGE OUTLINE
DIE SIZE BALL GRID ARRAY
1.918 mm, Min =
1.858 mm
0.918 mm, Min =
0.858 mm
4223082/A 07/2016

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