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PACKAGING INFORMATION
Orderable Device
Status
(1)
74LVC2G241DCTRE4
ACTIVE
74LVC2G241DCTRG4
ACTIVE
74LVC2G241DCURE4
ACTIVE
74LVC2G241DCUTE4
ACTIVE
74LVC2G241DCUTG4
ACTIVE
SN74LVC2G241DCTR
ACTIVE
SN74LVC2G241DCUR
ACTIVE
SN74LVC2G241DCUT
ACTIVE
SN74LVC2G241YZPR
ACTIVE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Package Type Package
Pins Package
Drawing
Qty
SM8
DCT
8
3000
SM8
DCT
8
3000
VSSOP
DCU
8
3000
VSSOP
DCU
8
VSSOP
DCU
8
250
SM8
DCT
8
3000
VSSOP
DCU
8
3000
VSSOP
DCU
8
250
DSBGA
YZP
8
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
& no Sb/Br)
TBD
Call TI
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
CU NIPDAU
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
CU NIPDAU | CU SN
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
CU NIPDAU | CU SN
Level-1-260C-UNLIM
& no Sb/Br)
Green (RoHS
SNAGCU
Level-1-260C-UNLIM
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
Op Temp (°C)
(3)
-40 to 125
C41
Z
-40 to 125
C41
Z
-40 to 125
C41R
Call TI
-40 to 125
-40 to 125
C41R
-40 to 125
C41
Z
-40 to 125
(C41Q ~ C41R)
-40 to 125
(C41Q ~ C41R)
-40 to 125
(C2 ~ C27)
http://www.ti.com/productcontent
for the latest availability
17-Aug-2015
Device Marking
Samples
(4/5)
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