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SN74LVC2G241 Dual Buffer and Driver With 3-State Outputs

1 Features

Available in the Texas Instruments
1
NanoFree™ Package
Supports 5-V V
Operation
CC
Inputs Accept Voltages to 5.5 V
Max t
of 4.1 ns at 3.3 V
pd
Low Power Consumption, 10-µA Maximum I
±24-mA Output Drive at 3.3 V
Typical V
(Output Ground Bounce)
OLP
<0.8 V at V
= 3.3 V, T
CC
Typical V
(Output V
OHV
>2 V at V
= 3.3 V, T
CC
I
Supports Live Insertion, Partial-Power-Down
off
Mode, and Back-Drive Protection
Can Be Used as a Down Translator to Translate
Inputs From a Max of 5.5 V Down
to the V
Level
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

2 Applications

AV Receivers
Blu-ray Players and Home Theaters
DVD Recorders and Players
Desktop or Notebook PCs
Digital Radio or Internet Radio Players
Digital Video Cameras (DVC)
Embedded PCs
GPS: Personal Navigation Devices
Mobile Internet Devices
Network Projector Front-Ends
Portable Media Players
Pro Audio Mixers
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Sample &
Product
Buy
Folder
CC
= 25°C
A
Undershoot)
OH
= 25°C
A
Tools &
Technical
Software
Documents
SCES210O – APRIL 1999 – REVISED DECEMBER 2015

3 Description

This dual buffer and line driver is designed for 1.65-V
to 5.5-V V
operation.
CC
The SN74LVC2G241 device is designed specifically
to improve both the performance and density of 3-
state memory-address drivers, clock drivers, and bus-
oriented receivers and transmitters.
NanoFree
package
breakthrough in IC packaging concepts, using the die
as the package.
The SN74LVC2G241 device is organized as two 1-bit
line drivers with separate output-enable (1OE, 2OE)
inputs. When 1OE is low and 2OE is high, the device
passes data from the A inputs to the Y outputs. When
1OE is high and 2OE is low, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up
or power down, OE should be tied to V
pullup resistor, and OE should be tied to GND
through a pulldown resistor; the minimum value of the
resistor is determined by the current-sinking or the
current-sourcing capability of the driver.
This device is fully specified for partial-power-down
applications using I
outputs,
preventing
through the device when it is powered down.
Device Information
PART NUMBER
SN74LVC2G241DCT SM8 (8)
SN74LVC2G241DCU VSOOP (8)
SN74LVC2G241YZP
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
1
1OE
2
1A
7
2OE
5
2A
Support &
Community
SN74LVC2G241
technology
is
a
through a
CC
. The I
circuitry disables the
off
off
damaging
current
(1)
PACKAGE
BODY SIZE (NOM)
2.95 mm × 2.80 mm
2.30 mm × 2.00 mm
DSBGA (8)
1.91 mm × 0.91 mm
6
1Y
3
2Y
major
backflow

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Summary of Contents for Texas Instruments SN74LVC2G241

  • Page 1: Features

    Folder Software Documents SN74LVC2G241 SCES210O – APRIL 1999 – REVISED DECEMBER 2015 SN74LVC2G241 Dual Buffer and Driver With 3-State Outputs 1 Features 3 Description This dual buffer and line driver is designed for 1.65-V • Available in the Texas Instruments to 5.5-V V...
  • Page 2: Table Of Contents

    Page • Updated document to new TI data sheet format........................• Removed Ordering Information table............................. • Updated Features................................... • Updated operating temperature range........................... Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 3 Output Input Output Output enable (Active high) — Ground — Power pin (1) N.C. – No internal connection (2) See Mechanical, Packaging, and Orderable Information for dimensions Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 4: Esd Ratings

    (1) All unused inputs of the device must be held at V or GND to ensure proper device operation. Refer to the TI application report Implications of Slow or Floating CMOS Inputs, SCBA004. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 5: Thermal Information

    = –40ºC to or GND 3.3 V 85°C = –40ºC to or GND 3.3 V 85°C (1) All typical values are at V = 3.3 V, T = 25°C. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 6: Switching Characteristics, T A = -40°C To 85°C

    = 5 V ± 0.5 V = 1.8 V ± 0.15 V 13.5 = 2.5 V ± 0.2 V = 3.3 V ± 0.3 V = 5 V ± 0.5 V Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 7: Operating Characteristics

    Outputs disabled = 3.3 V = 5 V 6.9 Typical Characteristic Typ. Char. Supply Voltage [V ] (V) C001 Figure 1. tpd vs Vcc Over Full Temperature Range Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 8: Parameter Measurement Information

    G. t and t are the same as t . H. All parameters and waveforms are not applicable to all devices. Figure 2. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 9: Functional Block Diagram

    A inputs to the Y outputs. When 1OE is high and 2OE is low, the outputs are in the high-impedance state. The SN74LVC2G241 is also an effective redriver, with a maximum output current drive of 32 mA. 8.2 Functional Block Diagram Figure 3.
  • Page 10: Application And Implementation

    SN74LVC2G241. The push button is in a physical location far enough away from the processor that the input signal is weak and needs to be redriven. The SN74LVC2G241 acts as a redriver, providing a strong input signal to the processor with as little as 1 ns of propagation delay.
  • Page 11: Layout

    Generally they will be tied to GND or V , whichever make more sense or is more convenient. 11.2 Layout Example Input Unused Input Output Unused Input Output Input Figure 6. Layout Diagram Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: SN74LVC2G241...
  • Page 12: Device And Documentation Support

    TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks NanoFree, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection.
  • Page 13 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing (4/5) 74LVC2G241DCTRE4 ACTIVE 3000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 &...
  • Page 14 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2015 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
  • Page 15 PACKAGE MATERIALS INFORMATION www.ti.com 1-Apr-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Reel Reel Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) 74LVC2G241DCUTG4 VSSOP 180.0 2.25 3.35 1.05 SN74LVC2G241DCTR 3000 180.0 13.0...
  • Page 16 PACKAGE MATERIALS INFORMATION www.ti.com 1-Apr-2017 *All dimensions are nominal Device Package Type Package Drawing Pins Length (mm) Width (mm) Height (mm) 74LVC2G241DCUTG4 VSSOP 202.0 201.0 28.0 SN74LVC2G241DCTR 3000 182.0 182.0 20.0 SN74LVC2G241DCUR VSSOP 3000 202.0 201.0 28.0 SN74LVC2G241YZPR DSBGA 3000 210.0 185.0 35.0...
  • Page 17 MECHANICAL DATA MPDS049B – MAY 1999 – REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,13 0,65 0,15 0,15 NOM 2,90 4,25 2,70 3,75 Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Ç Gage Plane Ç...
  • Page 19 PACKAGE OUTLINE YZP0008 DSBGA - 0.5 mm max height SCALE 8.000 DIE SIZE BALL GRID ARRAY BALL A1 CORNER 0.5 MAX SEATING PLANE 0.19 0.05 C 0.15 BALL TYP 0.5 TYP SYMM D: Max = 1.918 mm, Min = 1.858 mm E: Max = 0.918 mm, Min = 0.858 mm...
  • Page 20 SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4223082/A 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com...
  • Page 21 EXAMPLE STENCIL DESIGN YZP0008 DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.25) (R0.05) TYP (0.5) SYMM METAL SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4223082/A 07/2016 NOTES: (continued) 4.
  • Page 24 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products;...

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