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NXP Semiconductors
6.2 Pin description
Table 3.
Pin description
Symbol
1OE, 2OE
1A, 2A
1B, 2B
GND
V
CC
7. Functional description
Table 4.
Function selection
Input
nOE
L
H
[1]
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
−
°
°
T
=
40
C to +85
C, unless otherwise specified.
amb
Symbol
Parameter
V
supply voltage
CC
V
input voltage
I
I
switch current
SW
I
input clamping current
IK
T
storage temperature
stg
[1]
Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under
conditions for extended periods may affect device reliability.
[2]
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
9. Recommended operating conditions
Table 6.
Operating conditions
All unused control inputs of the device must be held at V
Symbol
Parameter
V
supply voltage
CC
V
HIGH-level input voltage
IH
V
LOW-level input voltage
IL
T
ambient temperature
amb
CBTD3306
Product data sheet
Pin
Description
1, 7
output enable input
2, 5
data input/output (A port)
3, 6
data input/output (B port)
4
ground (0 V)
8
positive supply voltage
[1]
All information provided in this document is subject to legal disclaimers.
Input/output
nA, nB
nA = nB
Z
[1]
Conditions
V
= 0 V
I/O
Section 9.
or GND to ensure proper device operation.
CC
Conditions
operating in free air
Rev. 8 — 1 May 2012
CBTD3306
Dual bus switch with level shifting
Min
−0.5
−0.5
[2]
-
−50
−65
is not implied. Exposure to absolute-maximum-rated
Min
Typ
4.5
-
2.0
-
-
-
−40
-
Max
Unit
+7.0
V
+7.0
V
128
mA
-
mA
°C
+150
Max
Unit
5.5
V
-
V
0.8
V
°C
+85
© NXP B.V. 2012. All rights reserved.
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