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NXP Semiconductors
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
L
1
e
8×
(2)
terminal 1
index area
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
max
max
0.25
mm
0.5
0.04
0.17
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
OUTLINE
VERSION
SOT833-1
Fig 16. Package outline SOT833-1 (XSON8)
CBTD3306
Product data sheet
1
2
8
7
e
e
1
1
D
0
b
D
E
e
2.0
1.05
0.6
0.5
1.9
0.95
REFERENCES
IEC
JEDEC
- - -
MO-252
All information provided in this document is subject to legal disclaimers.
b
3
4
6
5
e
1
1
scale
e
L
L
1
1
0.35
0.40
0.27
0.32
JEITA
- - -
Rev. 8 — 1 May 2012
Dual bus switch with level shifting
4×
(2)
L
A
A
1
E
2 mm
EUROPEAN
PROJECTION
CBTD3306
SOT833-1
ISSUE DATE
07-11-14
07-12-07
© NXP B.V. 2012. All rights reserved.
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