Sony BDP-CX7000ES Service Manual page 39

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• ET-001, MB-124-MEGA-EJ and VP-062EJ boards are
multi-layer printed board. However, the patterns of inter-
mediate-layers have not been included in this diagrams.
• Indication of transistor.
C
Q
These are omitted.
B E
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
BDP-CX7000ES
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• C : Panel designation.
Note: Note:
The components identi- Les composants identifi és
fi ed by mark 0 or dotted par une marque 0 sont
line with mark 0 are criti- critiques pour la sécurité.
cal for safety. Ne les remplacer que par
Replace only with part une pièce portant le nu-
number specifi ed. méro spécifi é.
• A : B+ Line.
• B : B– Line.
• H : Adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : BD PLAY
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
surface
• Signal path.
: AUDIO
F
: VIDEO
E
: BD/DVD
J
: USB
L
: LAN
d
• The voltage and waveform of CSP (chip size package)
cannot be measured, becaise its lead layout is different
from that of conventional IC.
• Circuit Boards Location.
MB-124-MEGA-EJ board
IMD (ES) board
PSWES board
FLDES board
JOGES board
LED board
SDR board
SDT board
STB board
39 39
VP-062EJ board
USB (ES) board
ET-001 board
AUES board
BRIDGE-ES board
FRTES board
FRBES board
PWRDR (ES) board
SLD board
SLK board
DR-510 board
MLD board
DRV board
MDO board
SDO board
BDP-CX7000ES
RSES board
switching regulator