Specifications - ASROCK X299 GAMING i9 User Manual

1.2 Specifications

Platform
CPU
Chipset
Memory
Expansion
Slot
2
• ATX Form Factor
• 8 Layer PCB
• 2oz Copper PCB
• Supports Intel® Core
LGA 2066 Socket
• Digi Power design
• 13 Power Phase design
• Supports Intel® Turbo Boost Max Technology 3.0
* Please note that the 4-Core processors only support Intel®
Turbo Boost Technology 2.0.
• Supports ASRock Hyper BCLK Engine III
• Intel® X299
• Quad Channel DDR4 Memory Technology
• 8 x DDR4 DIMM Slots
• Supports DDR4 4400+(OC)*/4266(OC)/4133(OC)/4000
(OC)/3866(OC)/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2
933(OC)/2800(OC)/2666/2400/2133 non-ECC, un-buffered
memory
* The maximum memory frequency supported may vary by
processor type.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports non-ECC RDIMM (Registered DIMM)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
• 4 x PCI Express 3.0 x16 Slots*
* If you install CPU with 44 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x8/x16/x0 or x8/x8/x16/x8.
* If you install CPU with 28 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x0/x8/x0 or x8/x0/x8/x8.
* If you install CPU with 16 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x0/x0/x0 or x8/x0/x4/x0.
* Supports NVMe SSD as boot disks
• 1 x PCI Express 2.0 x1 Slot
TM
X-Series Processor Family for the