SERVICE MANUAL
MICRO COMPONENT SYSTEM
7
2005
MB429
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
1
PRECAUTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2
3
DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
4
ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
5
TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
UX-G3, UX-G4
SP-UXG3
CA-UXG3
SP-UXG4
CA-UXG4
TABLE OF CONTENTS
COPYRIGHT © 2005 Victor Company of Japan, Limited
UX-G3
Area suffix
US ------------------------ Singapore
UB ---------------------- Hong Kong
UP ----------------------------- Korea
UT ---------------------------- Taiwan
UW ----------- Brazil,Mexico,Peru
UY ------------------------- Argentina
SP-UXG3
SP-UXG4
UX-G4
Area suffix
A ------------------------ Australia
US ------------------------ Singapore
UB ---------------------- Hong Kong
UT ---------------------------- Taiwan
UW ----------- Brazil,Mexico,Peru
No.MB429
2005/7