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Aureus TMS320DA708, TMS320DA708B, TMS320DA788B
Floating-Point Digital Signal Processors
SPRS297E – JULY 2005 – REVISED JULY 2007
5.3
PowerPAD™ Plastic Quad Flatpack Mechanical Data Drawing (RFP)
DA708/B/DA788B Device-Specific RFP (S-PQFP-G144)
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A.
All linear dimensions are in millimeters.
B.
This drawing is subject to change without notice.
C.
Body dimensions do not include mold flash or protrusion.
D.
The package thermal performance may be enhanced by bonding the thermal pad to an external plane. This pad is
electronically and thermally connected to the backside of the die and possibly selected leads. Actual size:
5.4 mm × 5.4 mm.
E.
Falls within JEDEC MS-026.
Mechanical Data
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30
PowerPAD™ PLASTIC QUAD
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