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A
B
Q Q
3 7 6 3 1 5 1 5 0
1
I PRINTED CIRCUIT BOARD (Foil side)
(Lead Type Device and Surface Mount Device)
AMP P. C. B. 2/2
2
3
T E
L
1 3 9 4 2 2 9 6 5 1 3
4
5
INPUT
6
• Semiconductor Location
Ref. No. Location
Ref. No. Location
Ref. No. Location
D307
I5
D317
F5
Q319
B4
w w w
D308
B5
D318
F5
Q320
B4
D309
B5
D319
F5
Q321
C4
D310
C5
D320
E5
Q322
C4
D311
C5
D321
E5
Q323
C4
.
D312
C5
D322
E5
Q324
C4
D313
D5
D323
I4
Q325
F4
7
D314
D5
D324
I4
D316
F5
Q318
B4
http://www.xiaoyu163.com
C
D
DSP
(CB1)
MODE
x
a o
u 1 6 3
y
i
http://www.xiaoyu163.com
E
F
G
8
9
AMP
(CB303)
Q
Q
3
7
6
3
1
5
DG
E-B
E-A
c o
.
H
I
2
4
9
8
VOLUME
DG
E-B
E-A
1
5
0
8
9
2
4
9
m
J
TSS-10
2
9
9
HEADPHONE
8
2
9
9
STANDBY/
ON
23
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