Table Of Contents; Leakage Test - Sony HCD-GTR33 Service Manual

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HCD-GTR33/GTR55/GTR77
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsol-
dering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following safe-
ty check before releasing the set to the customer:
Check the antenna terminals, metal trim, "metallized" knobs, screws, and
all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all
exposed metal parts to any exposed metal part having a return to chassis,
must not exceed 0.5 mA (500 microamperes.). Leakage current can be
measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA WT-
540A. Follow the manufacturers' instructions to use these instru-
ments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital
multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or
battery-operated AC voltmeter. The "limit" indication is 0.75 V, so
analog meters must have an accurate low-voltage scale. The Simpson
250 and Sanwa SH-63Trd are examples of a passive VOM that is
suitable. Nearly all battery operated digital multimeters that have a 2
V AC range are suitable. (See Fig. A)
To Exposed Metal
Parts on Set
0.15 μF
Fig. A. Using an AC voltmeter to check AC leakage.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
AC
1.5 kΩ
voltmeter
(0.75 V)
Earth Ground
WITH
SONY
PARTS

TABLE OF CONTENTS

1.
SERVICING NOTES
2.
2-1. Disassembly Flow ...........................................................
2-2. Case (Side-L/R) ..............................................................
2-3. Top Case..........................................................................
2-4. Tape Mechanism Deck ....................................................
DMB19 Board .................................................................
2-6. DC Fan (M101), Back Panel ...........................................
2-7. MAIN Board ...................................................................
2-8. POWER Board ................................................................
2-9. Chassis Section ...............................................................
2-11. Optical Pick-up Block (KHM-313CAB) ........................ 10
2-12. Belt (DLM3A) ................................................................ 10
3.
............................................................. 11
4.
5.
6.
6-2. Block Diagram - MAIN Section - ................................... 16
6-3. Block Diagram - AMP Section - ..................................... 17
- PANEL, POWER SUPPLY Section - ........................... 18
6-5. Printed Wiring Board - DMB19 Board - ........................ 20
6-9. Printed Wiring Board - MAIN Board - ........................... 24
6-13. Printed Wiring Board - HUB Board - ............................. 28
6-14. Schematic Diagram - HUB Board - ................................ 29
6-15. Printed Wiring Board - POWER Board - ........................ 30
6-16. Schematic Diagram - POWER Board - .......................... 31
6-18. Schematic Diagram - DISPLAY Board - ........................ 33
- MIC, USB AND VOLUME Board - ........................ 34
- MIC, USB AND VOLUME Board - ........................ 35
6-21. Printed Wiring Board - TC Board - ................................. 36
6-22. Schematic Diagram - TC Board - ................................... 36
6-23. Printed Wiring Board - TRANS Board - ......................... 37
6-24. Schematic Diagram - TRANS Board - ........................... 38
7.
7-1. Case Section .................................................................... 49
7-2. Top Panel Section ........................................................... 50
Board Section .................................................................. 51
7-4. DISPLAY Board Section ............................................... 52
7-5. Front Panel Section ........................................................ 53
7-6. Back Panel Section ........................................................ 54
7-7. MAIN Board Section ..................................................... 55
7-8. Chassis Section .............................................................. 56
(CDM88B-DVBU101) ................................................... 57
8.
................................................
........................ 13
.......................................... 14
............................... 58
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