HCD-GTZ2/GTZ2i/GTZ3/GTZ3i
Ver. 1.1
1.
2.
2-3. Top Case..........................................................................
2-6. Back Panel ......................................................................
2-7. MAIN Board ...................................................................
3.
............................................................ 10
4.
5.
NOTES ON CHIP COMPONENT REPLACEMENT
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
Keep the temperature of soldering iron around 270 °C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE
THESE
COMPONENTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
TABLE OF CONTENTS
.............................................
......................................... 12
WITH
SONY
PARTS
3
4
4
5
5
6
6
7
7
8
8
9
9
6.
6-1. Case Section .................................................................... 48
7.
Accessories are given in the last of the electrical parts list.
Note: Refer to supplement-1 for the DISPLAY board of printed
wiring board, schematic diagram and electrical parts list of
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classified as a CLASS 1
LASER product. This marking is located on
the rear exterior.
.............................. 56