Sony HT-ST7 Service Manual page 34

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HT-ST7
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
: Internal component.
f
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen
(Conductor Side)
from the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
Caution:
Pattern face side:
Parts on the pattern face side seen
(SIDE B)
from the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
Q
These are omitted.
B
E
• Abbreviation
AUS
: Australian model
CND : Canadian model
Note 1: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC3001, IC3003,
IC3005 AND IC3007 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD" on page 4.
Note 2: When the complete MAIN board is replaced, refer to
"ABOUT THE PAIRING METHOD" on page 4.
HT-ST7
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
: Internal component.
f
• 2 : Nonfl ammable resistor.
• 5 : Fusible resistor.
• C : Panel designation.
Note:
Note:
The components identi-
Les composants identifi és
fi ed by mark 0 or dotted
par une marque 0 sont
line with mark 0 are criti-
critiques pour la sécurité.
cal for safety.
Ne les remplacer que par
Replace only with part
une pièce portant le nu-
number specifi ed.
méro spécifi é.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO (ANALOG)
F
: AUDIO (DIGITAL)
J
E
: VIDEO
: Bluetooth
N
• Abbreviation
AUS
: Australian model
CND : Canadian model
Note 1: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC3001, IC3003,
IC3005 AND IC3007 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD" on page 4.
Note 2: When the complete MAIN board is replaced, refer to
"ABOUT THE PAIRING METHOD" on page 4.
• Circuit Boards Location
POWER board
MOUNTED board
34
34
AMP board
KEY board
IO board
Bluetoorh module
(BT1)
MAIN board
DISPLAY board
MOUNTED board
NFC (RC-S801/A)
(NFC1)

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