Main Board - Samsung SENS R60 Plus Service Manual

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- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -
- This Document can not be used without Samsung's authorization -
3. Disassembling and Reassembling
Area
Main
Board
Picture
Description

1. Main Board

2. Remove 8 Screws for HeatSink separation.
- Special Screw : 8 EA
*Caution
HeatSink Screws couldn't be disassembled.
3. CPU & MDC part
4. Lift CPU by right angle after turn Screw to
direction such as the picture for CPU separation.
*Caution
Take care so that CPU Pin may not bend.
SENS R60 Plus < 3 - 12 >

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