Onkyo BD-SP808CDC1N Service Manual page 8

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3. The flat pack-IC on the CBA is affixed with glue, so
3 7 63 1515 0
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
CBA
Masking
Tape
Tweezers
TE
L 13942296513
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Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
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With Soldering Iron:
2 9
8
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
Flat Pack-IC
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
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3
6 7
1 3
1 5
Fine Tip
Soldering Iron
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
co
.
1-4-2
9 4
2 8
Desoldering Braid
Soldering Iron
Fig. S-1-3
0 5
8
2 9
9 4
2 8
Sharp
Pin
Fig. S-1-4
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BDN_SN
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