Table Of Contents - Panasonic KX-TC2106UAB Service Manual

KX-TC2106UAB / KX-TC2106UAS / KX-TC2106UAT / KX-TC2106UAW
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
1.1. Suggested PbF Solder
1.2. How to recognize that Pb Free Solder is Used
2 FOR SERVICE TECHNICIANS
3 CAUTION
4 OPERATING INSTRUCTIONS
4.1. Battery
4.2. Location of Controls
4.3. Connection
4.4. Troubleshooting
5 DISASSEMBLY INSTRUCTIONS
6 TROUBLESHOOTING GUIDE
6.1. Check Power
6.2. Bell Reception
6.3. Check Battery Charge
6.4. Check Link
6.5. Check Handset Transmission
6.6. Check Handset Reception
7 ADJUSTMENTS (BASE UNIT)
7.1. Test Mode Flow Chart (Base Unit)
7.2. How to change the channel
7.3. Adjustment
7.4. Adjustment Standard (Base Unit)
8 ADJUSTMENTS (HANDSET)
8.1. Test Mode Flow Chart (Handset)
8.2. How to change the channel
8.3. Adjustment
8.4. Adjustment Standard (Handset)
9 RF SPECIFICATION
9.1. Base Unit
9.2. Handset
10 HOW TO CHECK THE HANDSET SPEAKER
11 FREQUENCY TABLE (MHz)
12 EXPLANATION OF CPU DATA COMMUNICATION
12.1. STAND-BY -> TALK, TALK -> STAND-BY
12.2. Ringing
12.3. Changing the Channel
Page
4 12.4. Ports for transmitting and receiving of data
4 12.5. Waveform of DATA used for cordless transmission and
5 reception
5 13 BLOCK DIAGRAM (BASE UNIT)
5 14 CIRCUIT OPERATION (BASE UNIT)
6 14.1. Outline
6 14.2. Power Supply Circuit
7 14.3. Reset Circuit
8 14.4. Charge Circuit
9 14.5. Telephone Line Interface
10 14.6. Transmitter/Receiver
12 15 BLOCK DIAGRAM (HANDSET)
13 16 CIRCUIT OPERATION (HANDSET)
14 16.1. Outline
15 16.2. Reset Circuit
16 16.3. Battery Low / Power Down Detector
17 17 SIGNAL ROUTE
18 18 CPU DATA (Base Unit)
19 18.1. IC201
19 19 CPU DATA (Handset)
20 19.1. IC701
20 20 RF IC (Base Unit and Handset)
21 20.1. Base Unit: IC401, Handset: IC801
22 21 HOW TO REPLACE THE FLAT PACKAGE IC
22 21.1. PREPARATION
23 21.2. FLAT PACKAGE IC REMOVAL PROCEDURE
23 21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
24 21.4. BRIDGE MODIFICATION PROCEDURE
25 22 CABINET AND ELECTRICAL PARTS (BASE UNIT)
25 23 CABINET AND ELECTRICAL PARTS (HANDSET)
25 24 ACCESSORIES AND PACKING MATERIALS
25 25 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
26
27 25.1. Base Unit
27 25.2. Handset
28 26 REPLACEMENT PARTS LIST
29 26.1. Base Unit
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