Servicing Notes - Sony FST-GTK11iP Service Manual

FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
MODEL IDENTIFICATION
– Bottom side view –
The written example of
model number label.
Displayed characters/
values are example.
R Model No.
OME AUDIO DOCKING SYSTEM
Power requirements
Model
GTK11iP: AEP, UK, AUS
GTK11iP: RU
GTK11iP: E2, EA, SP6
GTK11iP: MX
GTK33iP: US
GTK33iP: E2, E51
GTK33iP: MX
GTK33iP: AUS
• Abbreviation
AUS : Australian model
E2 : 120V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
MX : Mexican model
RU : Russian model
SP6 : Singapore and Malaysia models
4
SECTION 1

SERVICING NOTES

The written example of
stamp.
Displayed characters/
values are example.
Power requirements
Power requirements
AC:220 - 240V - 50/60Hz 45W
- 220 - 240V 50/60Hz 45W
AC:120 - 240V - 50/60Hz 45W
ca 127 V - 60 Hz 45 W
AC:120V - 60Hz 75W
AC:120 - 240V - 50/60Hz 75W
ca 127 V - 60 Hz 75 W
AC:220 - 240V - 50/60Hz 75W
NOTE THE D009 AND D010 ON THE LED (L) BOARD
REPLACING
D009 and D010 on the LED (L) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
NOTE THE D009 AND D010 ON THE LED (R) BOARD
REPLACING
D009 and D010 on the LED (R) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
THE OPERATION CHECK AFTER REPAIR
After repair is completed, connect corresponding "iPhone" etc.
to this unit and perform operation checks (playback, recording,
charging, etc.).
NOTE OF PERFORMING THE OPERATION CHECK
Don't perform the operation check in the state where the heat sink
was removed from this unit, by any means. When the operation
check is performed, be sure to fi x the heat sink to the board in
advance.
NOTE OF REPLACING THE IC702 ON THE MAIN
BOARD AND THE COMPLETE MAIN BOARD
When IC702 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between parts
and heat sink.
Part No. Description
J-2501-221-A THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
– MAIN Board (Component Side) –
IC702
IC702