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AC POWER WIRE
from
F1 fuse
FL1 line module
Plug the fan wires, ignoring color codes if any, onto the remaining pair of terminals.
Overall Troubleshooting Procedure
The overall troubleshooting procedure for the unit involves isolating the problem to one of several circuit blocks and
troubleshooting the block individually. The HP-IB/ microprocessor related circuit blocks are located on the A3 (front panel)
and the A8 (HP-IB) boards. They are referred to collectively as the HP-IB section. The power supply circuit blocks are on
the A1 (main), the A2 (control), the A4 (FET), and the A5 (diode) boards. They are referred to collectively as the power
section.
The flowchart of Figure 3-1 provides troubleshooting isolation procedures to guide you either to the appropriate circuit or to
one of the detailed troubleshooting procedures in this section. The purpose of the flowchart is only to isolate the problem to
a specific area of the power supply. If you have already isolated the problem, proceed directly to the applicable
troubleshooting section.
Table 3-1 lists the error codes that may appear on the front panel when the unit performs its internal selftest. Along with the
error codes, the table also identifies various circuits or components that may have caused that error code to appear.
In the Power Section Troubleshooting, Tables 3-10 and 3-11 give various power supply symptoms that identify the
corresponding board, circuit or components that may have caused that symptom. The symptoms in Table 3-10 may become
apparent when running the Performance Tests in Section 2.
HP-IB Section Troubleshooting
The HP-IB section troubleshooting consists of primary and secondary interface troubleshooting. Signature analysis is
required to troubleshoot the primary and secondary processor as well as the front panel board. Other circuits on the HP-IB
board, such as the voltage and current DACs, can be checked using either signature analysis or the front panel controls. The
readback circuits cannot be checked using signature analysis. Figure 3-2 illustrates the test setup that allows access to the
HP-IB board components for troubleshooting.
To remove the HP-IB board, perform the HP-IB board removal procedure discussed earlier in this section. Lay out the
board as shown in Figure 3-2 with a piece of insulating material under the board. Reconnect connectors W1, W2, W5, and
W6 after the board is on the insulating material.
Note:
The HP-IB board can be placed alongside the unit for troubleshooting by using extender cables provided
in service kit HP P/N 06033-60005.
color
wht/brn/gry
white/gry
PLUG ONTO TERMINAL
desig.
located
L
left-rear corner
N
right of above
33
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Table of Contents
Troubleshooting
