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CDX-GT250M
Q Q
3 7 6 3 1 5 1 5 0
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• CD mechanism (1/2) and (2/2) sections
no mark : CD PLAY
• Main (1/3), (2/3), (3/3) and Key sections
no mark : FM
(
) : AM/MW/LW
<
> : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
T E
L
1 3 9 4 2 2 9 6 5 1 3
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
F
: FM
f
: AM
L : AUX
3-4. CIRCUIT BOARDS LOCATION
SENSOR board
w w w
KEY board
CDX-GT250M
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Through hole.
a
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
C
Q
These are omitted
B
E
B
E
C
These are omitted
E
C
B
These are omitted
SERVO board
x
a o
y
tuner unit
(TU1)
.
i
MAIN board
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8
• WAVEFORMS
— SERVO BOARD — (CD PLAY)
1
IC2 5 (FEI)
0 V
Approx. 100 mVp-p
50 mV/DIV, 5 msec/DIV
2
IC2 6 (TEI)
0 V
Approx. 400 mVp-p
200 mV/DIV, 5 msec/DIV
3
IC2 wd (XI)
0.6 Vp-p
Q
Q
3
7
6
3
16.9344 MHz
0.2 V/DIV, 0.2 µ sec/DIV
— MAIN BOARD —
1
IC501 i; (XIN)
0.7 Vp-p
32.768 MHz
0.2 V/DIV, 0.1 µ sec/DIV
2
IC501 is (OSC IN)
0.8 Vp-p
18.432 MHz
u 1 6 3
0.5 V/DIV, 0.1 µ sec/DIV
.
16
16
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2
4
9
9
8
4
IC2 ia (RFI)
7
IC3 ia (X1)
Approx.
1Vp-p
12 MHz
0.5 V/DIV, 0.2 µ sec/DIV
0.5 V/DIV, 0.5 µ sec/DIV
5
IC2 of (FNI2), og (FNI1)
1.5 Vp-p
0.5 V/DIV, 0.5 µ sec/DIV
6
IC2 oh (FPI2),
oj (FPI1)
1.5 Vp-p
1
5
1
5
0
8
9
2
4
0.5 V/DIV, 0.5 µ sec/DIV
m
c o
2
9
9
1.1 Vp-p
9
8
2
9
9
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