Rockford Fosgate PUNCH 40.2 Operations & Installation Manual page 6

DSM
(Discrete Surface Mount) Technology
The DSM (Discrete Surface Mount) manufacturing process combines
the advantages of both discrete components and integrated circuitry.
Rockford Fosgate is the only American amplifier manufacturer to have
invested millions into this process. DSM components differ from
conventional discrete components in different ways. They are more
compact, more rugged, and they efficiently dissipate generated heat.
Using them wherever appropriate allows the advantages associated
with discrete circuitry to be retained while also providing room for
both highly advanced processing features and generous PC board
copper paths where needed. Their short lead-out structures allow
maximum audio performance and highest signal-to-noise ratios to be
obtained in amplifiers of desirable package size without resorting to
"amplifier-on-a-chip" shortcuts. These advantages are shown below
in Figure 1.
Figure 1
PC
Board
Thru-Hole
THE RESULT: Fewer connections, improved reliability, shorter signal
paths, superior signal-to-noise ratio and awesome sonic performance.
XCard
(Internal Crossover)
The Punch amplifiers utilize internal active crossovers. These cross-
overs have many performance advantages such as using discrete
components for exact frequency adjustments which are far superior to
potentiometers. Additionally, the XCard can be configured for high-
pass, low-pass and full range operation. With slight modifications,
many crossover frequencies and slope configurations can be achieved.
THE RESULT: Increased system design flexibility with a precise
electronic crossover without the limitations of conventional potenti-
ometer designs.
Component
Solder
Surface Mount
– 3 –
Solder
PC
Board