Sony PHA-1A Service Manual page 10

Portable headphone amplifier
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PHA-1A/1AEU
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen
(Conductor Side)
from the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
• Lead layouts
surface
Lead layout of conventional IC
CSP (Chip Size Package)
* Replacement of IC704 on the MAIN board used in this unit
requires a special tool.
When replacing the MAIN board, be sure to re-
Note:
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
PHA-1A/1AEU
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO (ANALOG)
F
J
: AUDIO (DIGITAL)
E
: iPhone/iPad/iPod
: WALKMAN/Xperia
j
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
* Replacement of IC704 on the MAIN board used in this unit
requires a special tool.
When replacing the MAIN board, be sure to re-
Note:
place the case simultaneously. Among the repair
parts, the MAIN board and case are supplied as
one unit.
• Waveforms
– MAIN Board –
IC401 7 (CF2)
1
3 Vp-p
83 ns
500 mV/DIV, 50 ns/DIV
2
IC401 qk (MCLK_OUT)
4.5 Vp-p
59.5 ns
1 V/DIV, 50 ns/DIV
3
IC401 wj (BCLK_OUT)
4 Vp-p
470 ns
1 V/DIV, 200 ns/DIV
IC401 wk (LRCK_OUT)
4
3.5 Vp-p
22.4 s
1 V/DIV, 20 s/DIV
IC500 6,7 (SW)
5
8 Vp-p
750 ns
2 V/DIV, 500 ns/DIV
IC501 9 (EXT)
6
4.1 Vp-p
3.1 s
1 V/DIV, 2 s/DIV
10
10

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